Patents Assigned to LeRain Technology Co., Ltd.
  • Patent number: 11955975
    Abstract: A routing integrated circuit element is disclosed. The routing integrated circuit element is connected between a first and a second electronic module and includes a body, a first, and a second buffer element. A first side of the body is connected to the first electronic module. A second side is connected to the second electronic module and located on a different side from the first side. The distance between the second side and the second electronic module is shorter than the distance between the second side and the first electronic module. The first buffer element transmits an electronic signal from the first side to the second side. The second buffer element transmits the electronic signal from the second side to the first side, wherein the transmission directions of the electronic signals transmitted by the first buffer element and the second buffer element are opposite.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: April 9, 2024
    Assignee: LERAIN TECHNOLOGY CO., LTD.
    Inventors: Miaobin Gao, Chia-Chi Hu
  • Patent number: 11892962
    Abstract: A GENZ port structure includes a body, a plurality of high-speed input pins, a plurality of high-speed output pins, a plurality of ground pins, a power supply pin, a plurality of differential clock pins, and a plurality of parameter setting pins. The main body includes a first side and a second side. The plurality of high-speed input pins are arranged on the first side. The plurality of high-speed output pins are arranged on the second side. The plurality of ground pins are interspersed between the plurality of high-speed input pins and the plurality of output pins. The power supply pins, the plurality of differential clock pins and the plurality of parameter setting pins are respectively arranged on one of the first side or the second side. The plurality of parameter setting pins are used to adjust an internal parameter setting of the GENZ port structure.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: February 6, 2024
    Assignee: LeRain TECHNOLOGY CO., LTD.
    Inventors: Miaobin Gao, Chia-Chi Hu
  • Patent number: 11778733
    Abstract: A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins, and ground pins. The main circuit unit is arranged in the center of the body. The power pins supply power signal to the main circuit unit. The input pins and the output pins are arranged on a first and a second side of the body separately for electrically connecting to the main circuit unit. The control pins are arranged on the second side of the body and electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins, and the control pins.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: October 3, 2023
    Assignee: LERAIN TECHNOLOGY CO., LTD.
    Inventors: Miaobin Gao, Chia-Chi Hu
  • Patent number: 11778732
    Abstract: A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins and ground pins. The main circuit unit is arranged in the center of the body. The power pins are arranged in the center of the body. The input pins are arranged at a first side of the body and are electrically connected to the main circuit unit. The output pins are arranged at a side of the body opposite to the first side and are electrically connected to the main circuit unit. The control pins are arranged at a second side of the body and are electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins and the control pins.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: October 3, 2023
    Assignee: LERAIN TECHNOLOGY CO., LTD.
    Inventors: Miaobin Gao, Chia-Chi Hu
  • Patent number: 11416439
    Abstract: A USB-C connection line and a USB-C connection line signal judgement method thereof are disclosed. The USB-C connection line can be connected between a first electronic device and a second electronic device. The USB-C connection line includes a receiver detector, a first signal detector, a second signal detector, and a controller. The receiver detector is used to detect whether a receiver signal is received; the receiver signal means that the first electronic device or the second electronic device is connected to a first port or a second port. The first signal detector and the second signal detector are used to detect whether an input signal is transmitted from the first electronic device or the second electronic device. The controller is used to determine whether any one of the input signal or the receiver signal is received so as to execute a startup procedure.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: August 16, 2022
    Assignee: LERAIN TECHNOLOGY CO., LTD.
    Inventor: Miaobin Gao
  • Patent number: 11308014
    Abstract: A bi-directional signal transmission connection cable is disclosed. The bi-directional signal transmission connection cable can be connected between a first and a second electronic device. The bi-directional signal transmission connection cable includes a first connection port, a second connection port, a first repeater chip, a second repeater chip and a plurality of transmission wires. The first and the second repeater chips are symmetrically disposed in the first and the second connection ports. The first repeater chip has a first set of adjustment parameters, and the second repeater chip has a second set of adjustment parameters. Thus, when a signal is transmitted between the first and the second electronic devices via the first connection port, the second connection port, and the plurality of transmission wires, the signal is adjusted by the first set of adjustment parameters and the second set of adjustment parameters.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: April 19, 2022
    Assignee: LeRain Technology Co., Ltd.
    Inventor: Miaobin Gao