Abstract: The present invention relates to a method of treating a surface of a utensil as well as to a utensil having been treated by the method. A substrate is provided to form a component of the utensil. The substrate has a surface area to be treated. Through a shot peening process particles impact the substrate substantially evenly across the surface area, so as to dimple the substrate with depressions across the surface area, in order to reduce adhesion of matter on the treated surface area of the utensil.

Abstract: A device for making patties of compressible food matter of different sizes, for example meat patties, comprises a first member having a first compression plate for making a patty of a corresponding size and shape. The device further comprises a second member to be added onto the first member. The second member has a second compression plate to extend from the first compression plate to form therewith a larger compression plate when the first member is mounted onto the second member, in order to make a food patty of a corresponding larger size. The first and second members have respective cooperating attaching means to connect the members in an assembled position.