Abstract: Method and apparatus for measuring process parameters of a plasma etch process. A method for detecting at least one process parameter of a plasma etch process being performed on a semiconductor wafer. The method comprises the steps of detecting light being generated from the plasma during the etch process, filtering the detected light to extract modulated light; and processing the detected modulated light to determine at least one process parameter of the etch process.
Type:
Application
Filed:
January 31, 2008
Publication date:
August 26, 2010
Applicant:
LEXAS RESEARCH, LTD.
Inventors:
Stephen Daniels, Shane Glynn, Felipe Soberon, Maria Tipaka