Abstract: An optical structure and a method of manufacturing a laser diode chip. The optical structure includes a silicon substrate, an optical fiber fixed to that substrate, and a laser diode chip. Grooves are formed in the optical fiber and the laser diode chip. Those grooves are used for aligning and positioning the optical fiber relative to the laser diode chip. The laser diode chip is manufactured by vapor-depositing a nitride thin film (Si3N4) on a laminated wafer comprised of n-type InP layers, p-type Inp layers, and InGaAs layer. Then, etching an InGaAs layer using a solution of sulfuric acid, hydrogen peroxide, and distilled water after opening an etching window to form a V-mesa and V-grooves; etching an InP layer using a hydrochloric acid solution; vapor-depositing a nitride thin film (SiNx), opening an electrode forming window to form electrodes on the wafer, and forming p-type and n-type electrodes the wafer.

Abstract: The present invention relates an optical element used in the field of optical communication and a method for aligning an optical fiber to connect an external optical communication system to the optical element.

Abstract: The present invention relates to an plug-in type electric interconnecting system.

Abstract: The present invention relates to a method for manufacturing a polarization film for a liquid crystal display and, more particularly, to a method for manufacturing a polarization film having improved wide band characteristics and improved reflectivity by binding together plural liquid crystal films having different selective light-reflecting central wavelengths.

Abstract: Disclosed is a splice closure for telecommunications cables. The splice closure includes a body having an upper portion and a lower portion, at least one entrance hole formed at opposing ends of the body, a plurality of flanges formed longitudinally along edges of both the upper and lower portions of the body where the same are joined, a compound reservoir formed between the flanges and into which a sealing compound is injected to form a seal, end stoppers having at least one cable hole and which are provided at ends of the splice closure, and plugs received in the cable holes of the end stoppers.