Abstract: A photosensitive resin composition includes: a copolymer of an unsaturated carboxylic acid and a compound with unsaturated ethylenic bonds; an acrylate multi-functional monomer; a phenolic compound; a photopolymerization initiator; and an organic solvent. The photosensitive resin composition according to the present invention has superior resolution and development property because of enlarged solubility differentiation between exposed and unexposed region. The photosensitive resin composition can be effectively used for a transparent protective layer, an insulating layer, a passivation layer, a patterned spacer, etc., for LCDs.