Abstract: The present invention provides a process and apparatus for mounting semiconductor components to substrates. More particularly, the apparatus includes a placing mechanism positioned on a support frame for placing the semiconductor components to the substrates. A reflow oven/furnace is integrated into the apparatus, thereby eliminating the need to transport the semiconductor components and substrates to an external furnace. Another feature of the present invention involves providing an improved vacuum substrate chuck array adapted for efficient application of suction to substrates carried thereby. Yet another feature of the invention involves a fluxless reflow process for inhibiting oxidation of eutectic solders provided on substrates.