Patents Assigned to LIEN DING SYSTEMS CO., LTD.
  • Publication number: 20140260884
    Abstract: A substrate processing method includes following steps. Multiple sawing blades are applied to a substrate for forming multiple side-by-side grooves. Each groove includes a short edge, and opposite a first long edge and a second long edge. A milling blade is used for milling one of the grooves. During the milling process the milling blade starts at a feed point and moves along a first feed path head toward the short edge, away from the groove, and intersects with the first long edge of the groove. The milling blade then proceeds to a second feed path, followed by moving to the third feed path, and eventually stops at an end point. The third feed path leads the milling blade toward the groove, away from the short edge of the groove, and then intersects with a second long edge of the groove before it eventually stops at the end point.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: LIEN DING SYSTEMS CO., LTD.
    Inventor: Ha-Dih HSIEH