Abstract: A method and apparatus for providing an automated process for fabricating a micro-solar assembly (66) consist of using printed circuit board manufacturing and etching techniques to provide first (8) and opposing (10) charge pathways. Printed circuit board techniques and its connection methodologies when applied to the fabrication of a micro-solar assembly (66) allows the solar chip (54) and diode (42) to be picked, placed and electrically and structurally bonded mechanically onto a printed circuit board (2), then covered with a polymer sealant (12) sprayed for impact resistance and electrical insulation, and additionally covered with a plastic lens cover (18) to focus light and facilitate automated insertion.