Abstract: A programmable logic array (PLA) in accordance with the invention achieves a maximum amount of depopulation of programmable connections while still implementing a logic function and maintaining flexibility for future reprogramming. In addition, a PLA in accordance with the invention can be built so that no matter what functionality is programmed, performance characteristics for the device are maintained. Further, a PLA in accordance with the invention does not require a regular array structure.

Abstract: In accordance with the invention, a method for customizing a one-time configurable integrated circuit to include a multi-time configurable structure is disclosed. Such a method includes, in one embodiment receiving a description of circuit functionality from a user for implementation in the one-time configurable device, where the functionality includes a portion that is designated by the user to be reconfigurable. A method in accordance with an embodiment of the invention then models a reconfigurable structure that has enough capacity to accommodate the designated functionality. Optionally, some embodiments of the invention add in more capacity than is required to implement the designated functionality to allow for future reprogramming. The method then embeds the reconfigurable structure in the one-time configurable device. In certain embodiments, the one-time configurable device can be a mask-programmed MBA, gate array, or standard cell, while the reconfigurable structure is a PLA or modified PLA.

Abstract: A customizable ASIC routing architecture is provided. The architecture utilizes the uppermost metal layers of an ASIC composed of an array of function blocks for routing among function blocks while lower layers are used for local interconnections within the function blocks. The second-to-uppermost metal layer is fixed and generally includes a plurality of parallel segmented conductors extending in a first direction. The uppermost metal layer is customizable in a predesignated manner. Metal in the uppermost metal layer is selectively placed in tracks, which are substantially perpendicular to the segmented conductors in the layer below. Vias are provided between the two uppermost layers. One embodiment of the invention permits one-mask customization of an ASIC.

Abstract: A new circuit architecture is provided for testing digital integrated circuits which allows one to arbitrarily force any combination of logic values to be simultaneously driven onto any combination of internal nets. This allows all of the connections to each internal logic cell, and the logic cell itself, to be verified by applying a set of test patterns to each logic cell individually. In this way, the integrity of the entire device can be verified without having knowledge of the operation of the circuit as a whole.