Abstract: An apparatus and method to cut irregularly shaped dice from a wafer using a fluid jet cutting system. One embodiment of the invention involves a method to cut irregularly shaped dice from a wafer, such as planar light-wave circuit device. The method includes placing a wafer on a fixture; aligning the wafer in the fixture to expose the dice to a fluid jet cutting nozzle; supplying an abrasive to the fluid jet cutting nozzle; supplying a pressurized fluid to the fluid jet cutting nozzle expelling the abrasive in combination with the fluid from the fluid jet cutting nozzle at a velocity sufficient to cut through the wafer, while the fluid jet cutting nozzle moves in relation to the wafer in the fixture; and removing the dice from the fixture after the dice have been cut from the wafer. A second embodiment of the invention is directed to an apparatus to provide a wafer die cutting system to cut a wafer.

Abstract: Hybrid integrated planar photonics provides silica waveguides for transport and polymer or hybrid silica/polymer waveguides for refractive-based active functions within a single integrated photonic circuit. Functions include modulation, attenuation, switching, filtering, and exceptionally low-loss transport. When the active and passive optical elements are integrated onto the same substrates, the resulting composite devices can exhibit strong functional response with little total optical loss as compared to known methods.