Abstract: In one embodiment, a delay-locked loop (DLL) for synchronizing a phase of a periodic digital output signal with a phase of a periodic digital input signal includes a deskew element responsive to the periodic digital input signal to the DLL and the periodic digital output signal from the DLL for suppressing jitter in the periodic digital output signal by synchronizing transitions in the periodic digital output signal with transitions in the periodic digital input signal and generating a final jitter-suppressed periodic digital output signal.

Abstract: A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

Abstract: A multiple piecepart alignment and attachment configuration for mating a fiber array (or even a single fiber) with a silicon photonic subassembly utilizes ever-tightening alignment tolerances to align the fiber array with a similar array of waveguides (or other devices) formed within the photonic subassembly. A box-shaped fiber holder is formed to include a plurality of grooves within its bottom interior surface to initially support the fiber array. A separate piecepart in the form of a lid is mated to, and aligned with, the silicon photonic subassembly. The lid is formed to include registration features on its underside that fit into alignment detents formed in the top surface of the silicon photonic subassembly upon attachment. The lid also includes a number of grooves formed on its underside that will capture the top surface of the fibers as the fiber holder is slide into place over the lid.