Abstract: A memory module comprises a base plate and one or more IC embedding seats formed thereon to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip, particularly no longer using SMT, soldering paste, or flux for IC maintenance and replacement; the IC embedding seat comprises a mainbody and a sliding cover formed a cover to the mainbody with sliding movement to open or close the mainbody, and the mainbody has one or more IC mounting compartments has a plurality of conducting pin units arrayed in matrix arrangement to form electric connection with the base plate; during IC maintenance and replacement, the defective IC memory chip shall be freely removed from the memory module without de-soldering to prevent other good IC memory chip from damage due to high temperature.

Abstract: A wafer test card applicable for testing all the chips on a wafer in one time simultaneously comprising a base board carrying testing circuit thereon and an electric conductive spring-rubber assembly connected to the underside of the base board; the electric conductive spring-rubber assembly has an electric insulating soft rubber layer which has an electric conductive spring matrix formed by a group of electric conductive springs arranged in rows and columns to form an electric connection with the testing circuit of the base board, and the electric conductive spring matrix of the electric conductive spring-rubber assembly is functioned as a wafer test interface to the wafer test card; during wafer test the electric conductive spring matrix of the wafer test card shall keep correctly touching and pressing against the pads of chips on a wafer to obtain more stable and reliable test result.

Abstract: A wafer test card for testing the electric property of the chips on a wafer comprising a base board and a group of electric conductive springs or electric conductive spring pins connected to the base board and functioned as a wafer test interface to the wafer test card, the base board has a testing circuit thereon which forms electric connection with the electric conductive springs or electric conductive spring pins; when carrying out wafer test, even if the elevation of the pad of each individual chip is different from each other, the electric conductive spring or electric conductive spring pin of the wafer test card shall still keep correctly touching the pad of chip to obtain better and more stable electric property test result, and avoid mistake in identifying the chip.

Abstract: A memory module comprises a base plate disposed with a plurality of printed circuit sets and one or more IC embedding frames fixed on the base plate, particularly each IC embedding frame having a rubber spring connector stored inside which comprises an insulating flexible silicone rubber layer embedded with a conductive spring matrix composed of a group of conductive spring modules in longitudinal and latitudinal matrix arrangement and is through its conductive spring modules formed in electrical connection with a corresponding printed circuit set of the base plate; the memory module is to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip without use of SMT, soldering paste or flux.

Abstract: A rubber spring connector with characteristic of extended and repeated use in electrical connection with electric components has an insulating flexible silicone rubber layer which is embedded with a conductive spring matrix composed of a group of conductive spring modules in longitudinal and latitudinal matrix arrangement.

Abstract: A VGA interface card comprises a base plate with a GPU and one or more IC embedding seats formed thereon to have IC memory chip being installed in detachable manner which provides the advantage of easy installation, convenient maintenance or replacement of IC memory chip, particularly no longer using SMT and soldering paste or flux for IC maintenance and replacement; the IC embedding seat used on the VGA interface card comprises a mainbody having one or more IC mounting compartments and a sliding cover formed a cover to the mainbody with sliding movement to open or close the mainbody, and each IC mounting compartment of the mainbody has a plurality of conducting pin units arrayed in matrix arrangement to form electric connection with the base plate; during IC maintenance and replacement, any defective IC memory chip shall be freely removed from the VGA interface card without de-soldering to prevent other good IC memory chip from damage due to high temperature.

Abstract: An IC embedding seat comprises a body and a sliding cover to form a sliding mechanism provided for IC with BGA package no longer using SMT, soldering paste, or flux for IC maintenance and replacement, the body has one or more IC containers each of which bottom has a conducting pin array formed by a plurality of conducting pin units with elasticity and conductivity arrayed in matrix arrangement, and the sliding cover is constructed a cover to the body with sliding movement to open or close the body, so that the IC is easily embedded into the IC container of the body to get a well electrical connection with the corresponding conducting pin units of the body after simply sliding the sliding cover to close the body, and without de-soldering process the embedded IC is freely removed from the IC container by sliding the sliding cover to open the body.

Abstract: A memory module comprises a base plate and one or more IC embedding seats formed thereon to provide IC memory chip being installed in detachable manner taking the advantage of easy installation, convenient maintenance or replacement of IC memory chip, particularly no longer using SMT, soldering paste, or flux for IC maintenance and replacement; the IC embedding seat comprises a mainbody and a sliding cover formed a cover to the mainbody with sliding movement to open or close the mainbody, and the mainbody has one or more IC mounting compartments has a plurality of conducting pin units arrayed in matrix arrangement to form electric connection with the base plate; during IC maintenance and replacement, the defective IC memory chip shall be freely removed from the memory module without de-soldering to prevent other good IC memory chip from damage due to high temperature.

Abstract: An IC embedding seat comprises a body and a sliding cover to form a sliding mechanism provided for IC with BGA package no longer using SMT, soldering paste, or flux for IC maintenance and replacement, the body has one or more IC containers each of which bottom has a conducting pin array formed by a plurality of conducting pin units with elasticity and conductivity arrayed in matrix arrangement, and the sliding cover is constructed a cover to the body with sliding movement to open or close the body, so that the IC is easily embedded into the IC container of the body to get a well electrical connection with the corresponding conducting pin units of the body after simply sliding the sliding cover to close the body, and without de-soldering process the embedded IC is freely removed from the IC container by sliding the sliding cover to open the body.

Abstract: A printed circuit board provided with one or more than one memory-embedding seat fixed on one or two sides of the printed circuit board, each memory-embedding seat has a holding compartment for embedding or removing a memory chip; the holding compartment has a conductive pin array on a bottom thereof which conductive pin array comprises a plurality of conductive pin units configured in the form of matrix providing flexibleness and conductive functions; particularly, when memory chips are respectively embedded in the memory-embedding seats on the printed circuit board to form a memory module without the need of SMT, solder pastes or fluxes and in conformity with the requirements of environmental protection; when maintenance or replacement is required, what needs to be done is only remove the damaged memory chips and insert a new memory chips; and when upgrading is required, users can easily change the memory chip with a new memory chips of larger capacity by themselves.