Abstract: An ammonia-free reducer is added to cupric ions to achieve reduction to cuprous hydroxide in a process for the deposition of metallic copper on a catalytically activated surface by rapidly reducing cupric ions in aqueous solution to cuprous hydroxide, without substantial reduction to elemental or metallic copper, and thereafter effecting controlled disproportionation of the resultant cuprous hydroxide to bring about the deposition of metallic copper. The ammonia-free reducer is preferably hydroxylamine or its salts in the presence of a water soluble alkali metal- or alkaline earth metal- hydroxide, more preferably sodium hydroxide. The process of reduction of cupric ions is further effected by adding to the solution an antiagglomerating agent for controlling the dispersion of the cuprous hydroxide, preferably a polyol such as sorbose or invert sugar.