Abstract: A stereoscopic display module includes an array of multiple light emitting packages, each of which is topped by a polarizer. Package-polarizer sets are closely spaced, such that at 10% of oblique light from a middle package-polarizer set is blocked by adjacent package-polarizer sets. In preferred embodiments 0.3h?d?0.7h, where h is the distance between the bottom of the polarizers and the bottom of the light emitters, and d, the distance between edges of adjacent light-emitting packages. Glass-On-Board (GOB) packages and Chip-On-Board (COB) packages are contemplated, with any suitable combination of color light emitters. Modules preferably include arrays of at least 9, 16, 32, 64, and 128 package-polarizer sets.

Abstract: A stereoscopic display system has a non-planar display, in which some of the light emitting packages or polarizers are rotated relative to other packages. The out-of-normal orientation provides improved 3D imaging to an observer viewing the display through stereoscopic glasses.

Abstract: Light emitters are optically isolated from each other by a high opacity filler, resulting in a large percentage of the emitted light passing through the polarizers. Ideally, that arrangement causes all of the light from the light emitters to either be absorbed by the high opacity filler material, or pass up through an optional diffuser, a polarizer, and then through a low opacity coating that serves to protect the polarizers. In practice, at least 45% of light passing out of the device passes through a polarizer, more preferably at least 75% or even at least 90% of light passing out of the device passes through a polarizer. A diffuser is included under the polarizer.

Abstract: The present invention provides systems, and methods for manufacturing polarized light emitting semiconductor packages, comprising the disposition of a first bonding solution about (a) a first light emitting element and (b) a first polarizing element, wherein the first polarizing element transmits linearly polarized light in a first directionality. A first energy is applied to polymerize the first bonding solution, thereby encapsulating the first polarizing element and a first light emitting element in a first semiconductor package. A second bonding solution is disposed about (a) a second light emitting element and (b) a second polarizing element, wherein the second polarizing element transmits polarized light in a second directionality different from the first directionality, and a second energy is applied to polymerize the second bonding solution, thereby encapsulating the second polarizing element and the second light emitting element in a second semiconductor package.

Abstract: The present invention provides systems, and methods for manufacturing polarized light emitting semiconductor packages, comprising the disposition of a first bonding solution about (a) a first light emitting element and (b) a first polarizing element, wherein the first polarizing element transmits linearly polarized light in a first directionality. A first energy is applied to polymerize the first bonding solution, thereby encapsulating the first polarizing element and a first light emitting element in a first semiconductor package. A second bonding solution is disposed about (a) a second light emitting element and (b) a second polarizing element, wherein the second polarizing element transmits polarized light in a second directionality different from the first directionality, and a second energy is applied to polymerize the second bonding solution, thereby encapsulating the second polarizing element and the second light emitting element in a second semiconductor package.