Abstract: A method for manufacturing a multilayer wiring board is disclosed. The Method comprises a step (I) of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane; and a lamination step (II) of overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive material provided between the facing electrical connection pads. In the step (I), to at least one of surfaces faced when the boards are overlaid in the step (II), an insulating film having through holes formed in positions corresponding to the electrical connection pads on the surface is attached (Ia), and the conductive material is provided in the through holes (Ib).

Abstract: A method for manufacturing a multilayer wiring board is disclosed. The method includes steps of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane, overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive paste provided between the facing electrical connection pads. To prepare the printed wiring boards, attach an insulating film to at least one of surfaces faced when the boards are overlaid in the overlaying, bore holes in the insulating film so that the electrical connection pads are exposed, and provide a conductive paste in the holes.