Patents Assigned to Linden Design Technologies, Inc.
  • Evaluation method for interconnects interacted with integrated-circuit manufacture
    Patent number: 8001492
    Abstract: A design and evaluation method for interconnect wires of integrated circuits is provided to detect, analyze and predict response of interconnect layout to integrated-circuit manufacture processes.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: August 16, 2011
    Assignee: Linden Design Technologies, Inc.
    Inventor: Wallace W. Lin