Patents Assigned to lintel Corporation
  • SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION
    Publication number: 20150050781
    Abstract: Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.
    Type: Application
    Filed: October 31, 2014
    Publication date: February 19, 2015
    Applicant: lintel Corporation
    Inventors: John S. Guzek, Javier Soto Gonzalez, Nicholas R. Watts, Ravi K Nalla