Patents Assigned to Linxens Holding
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Patent number: 12361257Abstract: Electrical circuit for a smart card chip module, including an insulating layer having a front main face and a rear main face. An antenna is made in a first conductive layer laying on the rear main face. This antenna extends over an antenna area delimited by a peripheral edge. The antenna includes at least one inner loop and one outer loop. The outer loop runs along the peripheral edge except over at least one first connecting segment diverted from the peripheral edge, towards or in a central zone of the antenna area. Further, the outer loop of the antenna includes at least a second connecting segment diverted from the peripheral edge towards a central zone of the antenna area.Type: GrantFiled: July 24, 2020Date of Patent: July 15, 2025Assignee: Linxens HoldingInventors: Yean Wei Yeap, Wen Qiang Chin
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Patent number: 12131987Abstract: Biometric sensor module for a chip card, and method for producing such a module. Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, both forming main faces of the carrier, attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area on the front face, producing electrically conductive connection pads on the back face of the carrier which are electrically connected to the biometric sensor, at least one connection pad includes a region that is wettable with a solder material, extending over an area of between 0.2 and 5 square millimetres.Type: GrantFiled: April 16, 2020Date of Patent: October 29, 2024Assignee: Linxens HoldingInventors: Christophe Mathieu, Carsten Nieland
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Patent number: 12106168Abstract: Method for the electrochemical metallization of a double-sided electrical circuit for a chip card. Contacts and current leads are located on a front face. An antenna and connection pads are located on a rear face. This method includes an operation of electrochemically depositing at least one layer of electrically conductive material on connection pads, while supplying these connection pads with current via the current leads, contacts and metallized holes establishing electrical continuity between the front face and the rear face. This method furthermore includes, after the operation of electrochemically depositing at least one layer of electrically conductive material, an operation of electrically isolating at least one metallized hole from a connection pad. Electrical circuit obtained using this method.Type: GrantFiled: May 18, 2021Date of Patent: October 1, 2024Assignee: Linxens HoldingsInventors: Nicolas Michaudet, Thierry Dumont
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Patent number: 11894295Abstract: Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.Type: GrantFiled: October 25, 2021Date of Patent: February 6, 2024Assignee: Linxens HoldingInventors: Christophe Mathieu, Guillaume Gimbert
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Patent number: 11775794Abstract: Biometric sensor module for a chip card, and method for producing such a module Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, the front face being coated with an electrically conductive layer in which a bezel is formed, at least one conductive via being made in the thickness of the carrier to electrically connect the bezel to the back face, producing a protective layer on the front face, covering a protection area located inside the bezel, and attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite the protection area.Type: GrantFiled: April 16, 2020Date of Patent: October 3, 2023Assignee: Linxens HoldingInventors: Christophe Mathieu, Claire Laurens De Lopez
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Patent number: 11640514Abstract: The invention relates to a chip card designed to communicate data in a contactless mode with a card reader operating at a reading frequency. The resonance frequency of the chip card may change according to the capacitance of the chip used in the contactless mode of the chip card. In order to be able to use various chips without changing the booster antenna design, the card antenna circuit is provided with a capacitance element such that the chip card including the card antenna circuit and the chip module has two different resonance frequencies, one of which being equal to, or lower than, the reading frequency and the other being equal to, or greater, than the reading frequency. This create a broadband wherein the reading frequency falls.Type: GrantFiled: January 31, 2019Date of Patent: May 2, 2023Assignee: Linxens HoldingInventors: Yean Wei Yeap, Minli Cindy Ng, Wen Qiang Chin
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Patent number: 11412620Abstract: The invention relates to a process for manufacturing a roll of flexible carrier bearing electronic components. This process includes a step consisting in adding, to this flexible carrier, electronic components, themselves manufactured from a roll of flexible initial substrate. For example, the electronic components may be manufactured on an initial substrate having a width allowing advantage to be taken of densification of the manufacture of the components on this initial substrate. Subsequently, the singulated electronic components are added to the flexible carrier, allowing, for example, packaging that is more suitable, than possible with the initial substrate, to a use of the electronic components, notably when the latter must be integrated into a chip-card. Thus, for example, the flexible carrier may be, or include, an adhesive, which may or may not be conductive, and which is used to fasten, and optionally connect, each electronic component to a chip-card.Type: GrantFiled: June 12, 2019Date of Patent: August 9, 2022Assignee: Linxens HoldingInventor: Christophe Mathieu
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Patent number: 11047060Abstract: An electrical circuit, for example a printed circuit, for producing a module for integration into a card such as a chip card. This module includes electrical contact or connector which includes lands for the connection and communication of the chip with a read/write system. To give them a white color, or a color close to white, these electrical contact lands are at least partially covered with a layer of a rhodium alloy. The invention also relates to a method for manufacturing such an electrical circuit.Type: GrantFiled: November 27, 2018Date of Patent: June 29, 2021Assignee: Linxens HoldingInventors: Hugues Nsalambi, Florian Venon, Jérome Sanson, Guillaume Cardoso
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Patent number: 10810477Abstract: The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.Type: GrantFiled: July 23, 2019Date of Patent: October 20, 2020Assignee: Linxens HoldingInventors: Christophe Mathieu, Bertrand Hoveman
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Patent number: 10804226Abstract: The invention relates to a chip card manufacturing method. According to this method, there are produced on the one hand, a module including a substrate supporting contacts on one face, and bonding pads on the other, on the other hand, an antenna on a support. The ends of the antenna are linked to lands of connection lands receiving a drop of soldering material on a connection portion. In order to make the soldered electrical connection between the module and the antenna reliable, the bonding pads extend over a zone covering a surface area less than that of the connection portions. The invention relates also to a chip card whose module includes bonding pads extending over a zone covering a surface area less than that of the connection portions.Type: GrantFiled: May 3, 2017Date of Patent: October 13, 2020Assignee: Linxens HoldingInventors: Cyril Proye, Eric Eymard
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Patent number: 10740670Abstract: The invention relates to a method for fabricating chip cards. According to this method, an antenna and a chip card module are provided. This chip card module includes a dielectric substrate and conducting tracks at least on a face of this substrate. A connection unit is used to establish a connection between the antenna and conducting tracks of the module. The invention also relates to a method for fabricating an antenna support including such a connection unit. The invention also relates to a chip card and an antenna support which are obtained by the aforementioned methods.Type: GrantFiled: March 30, 2017Date of Patent: August 11, 2020Assignee: Linxens HoldingInventors: Cyril Proye, Valerie Mousque, Christophe Paul
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Patent number: 10706346Abstract: The invention relates to a method for producing a chip card module. According to this method, the following are produced: a module with a substrate having contacts and an electronic chip connected to at least some contacts; an antenna on a carrier, this antenna including two ends, each equipped with a connection land; a cavity in at least one layer of the card at least partially covering the carrier, in order to house the module and to expose the connection lands of the antenna; a first end of a wire is connected directly to a connection pad of the chip, and another portion is connected directly to a connection land of the antenna, after having inserted the module into the cavity.Type: GrantFiled: January 25, 2017Date of Patent: July 7, 2020Assignee: Linxens HoldingInventor: Eric Eymard
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Patent number: 10592796Abstract: A chip card manufacturing method. A module includes a substrate supporting contacts on one surface and conductive paths and a chip on another; and an antenna on a holder, the antenna including a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of the contact pads of the antenna. The holder of the antenna is inserted between plastic layers. A cavity is provided, in which the module can be accommodated and the solder drops remain accessible. The height of the solder drops before heating is suitable for projecting into the cavity. A module is placed in each cavity. The areas of the module that are located on the solder drops are heated to melt the solder and to solder the contact pads of the antenna to conductive paths of the module.Type: GrantFiled: September 30, 2015Date of Patent: March 17, 2020Assignee: Linxens HoldingInventors: Eric Eymard, Cyril Proye, Nicolas Guerineau, Christophe Paul
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Patent number: 10417548Abstract: The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.Type: GrantFiled: May 13, 2015Date of Patent: September 17, 2019Assignee: Linxens HoldingInventors: Christophe Mathieu, Bertrand Hoveman
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Patent number: 10102470Abstract: The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a color appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a coloring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.Type: GrantFiled: August 22, 2016Date of Patent: October 16, 2018Assignee: Linxens HoldingInventors: Mara Coppola, Yannick De Maquille, Fabien Marcq
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Patent number: 9799598Abstract: Method for producing at least one electronic chip support, from a plate that includes a first face intended to be in contact with a chip reader, a second face, covered with a first layer of electrically conductive material and intended to be linked to a radio antenna, and a core made from an electrically insulating material separating the first face from the second face. This method includes steps of drilling at least one through hole through the plate, depositing a layer of electrically conductive material on the first face and chemically etching a first electric circuit and a second electric circuit on the first face and the second face respectively. Prior to the chemical etching step, a step of depositing a third layer of electrically conductive material in the hole or holes, which covers the electrically insulating material in the corresponding hole or holes.Type: GrantFiled: November 18, 2014Date of Patent: October 24, 2017Assignee: Linxens HoldingInventor: Eric Eymard
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Publication number: 20170270398Abstract: The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.Type: ApplicationFiled: May 13, 2015Publication date: September 21, 2017Applicant: Linxens HoldingInventors: Christophe MATHIEU, Bertrand HOVEMAN
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Patent number: 9583459Abstract: The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive material insulated from each other by a layer of insulating material, connection holes extending through the layer of insulating material and blocked by one of the layers of electrically conductive material, an area free of conductive material being provided in the other layer of electrically conductive material around the connection holes. The invention also concerns a printed circuit for a chip card produced using this method and a chip card module including such a printed circuit.Type: GrantFiled: May 27, 2014Date of Patent: February 28, 2017Assignee: Linxens HoldingInventors: Severine Dieu-Gomont, Bertrand Hoveman
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Patent number: 9572265Abstract: The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.Type: GrantFiled: June 12, 2013Date of Patent: February 14, 2017Assignee: Linxens HoldingInventors: Séverine Dieu-Gomont, Francois Lechleiter, Yannick De Maquillé
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Patent number: 9508905Abstract: The inventions relates to a method of manufacturing a circuit incorporating a solid state light emitting component, the method including providing an insulating layer, producing at least one through hole in the insulating layer, providing a conductive layer, bonding a main surface of the conductive layer to the insulating layer, and positioning at least one solid state light emitting component in the hole of the insulating layer and connecting this component to the conductive layer.Type: GrantFiled: December 14, 2011Date of Patent: November 29, 2016Assignee: Linxens HoldingInventors: Francois Lechleiter, Pierre-Alois Welsch, Yannick de Maquille