Abstract: The present invention refers to a dual interface electronic module for a smart card and to the fabrication method thereof. The dual interface electronic module comprises a contact plate for external connection, which includes at least one antenna electrical connector, and a multilayered PCB including a value-add component, for instance a display. The contact plate and the multilayered PCB are connected together by means of a plurality of interconnects at an interconnection interface; the contact plate has a first area in correspondence of the interconnection interface and the multilayered PCB has a second area in correspondence of the interconnection interface. The first area is larger than the second area, so as to define an excess portion and at least one portion of the at least one antenna electrical connector is placed on the excess portion so as to be exposed for being electrically connected to a corresponding antenna of the smart card.

Abstract: The invention relates in various aspects to a printed circuit for integration into a smart card, a smart card with such a printed circuit and to a reel-to-reel tape for use in a fabrication process of a smart card, wherein the reel-to-reel tape comprises a plurality of such printed circuit. In some illustrative embodiments of an aspect, a printed circuit is provided, the printed circuit comprising a printed circuit support, an antenna wiring pattern of at least one winding continuously extending between a first terminal and a second terminal, and at least one antenna path portion continuously extending between a third terminal and a fourth terminal. Herein, each of the at least one antenna path portion extending between the third and fourth terminal can increase a path length of the antenna wiring pattern if connected to the antenna wiring pattern, adding a path length of the at least one added antenna path portion to the initial path length of the antenna wiring pattern.

Abstract: The present invention refers to a pre-package for a flexible printed circuit board for a smartcard. The pre-package comprises a flexible printed circuit board including one or more non-planar circuit portions; a first layer of a first material at least partially covering a first side of the flexible printed circuit board so as to form a planar layer; a second layer of a second material covering a second side of the flexible printed circuit board; and a third layer comprising a hardening material at least partially covering the first side so as to form a planar layer. The third layer has a third hardness value which is higher than the first hardness value and/or than the second hardness value of the first and second dielectric materials, respectively. The pre-package may be advantageously inserted into a smartcard having a suitable window for accommodating the pre-package comprising the electronic components.

Abstract: In accordance with illustrative embodiments, a sensing system includes: a flexible substrate, at least one sensor device, a chip device, and at least one electrical line, the at least one electrical line electrically connecting the chip device and the at least one sensor device. The at least one sensor device, the chip device, and the at least one electrical line are integrated into the flexible substrate.

Abstract: A process for manufacturing a sensor including at least two electrodes, including providing a flexible dielectric substrate having a layer of electrically conductive material on at least one of its sides. The electrodes, conductive connecting tracks and a common current supply track are etched in the layer of electrically conductive material. The process further includes electrodepositing one or more layers on the two electrodes and a step of selectively depositing, electrochemically, on at least one electrode, at least one layer of a material different from the one or more materials already deposited on another electrode.

Abstract: In aspects, the present invention relates to a wire pad design of a connection pad in a prelam body of a smart card, to a prelam body with at least one such connection pad embedded into a substrate, to a smart card comprising such a prelam body, to a method of forming a wire pad design of a connection pad of a prelam body of a smart card, and to a method of forming a smart card. In some illustrative embodiments, a wire pad design of a connection pad in a prelam body of a smart card is provided, the wire pad design comprising a connection pad wiring pattern formed by plural wire portions extending in a contacting pad plane, and a bridging wire portion which at least partially extends outside the contacting pad plane. The bridging wire portion electrically and mechanically connects at least some of the plural wire portions with each other.

Abstract: A method for manufacturing flexible printed circuits for smart card modules, wherein a complex material is provided. This complex material includes an assembly including at least two different-colored strata. Zones of this assembly are visible through the layer of electrically conductive material. This manufacturing method includes an operation that consists in laser etching at least one of the two different-colored strata over a portion of that zone of the assembly of strata that is left visible, so as to reveal the color of the other of the two different-colored strata. Printed circuit manufactured by this method. Module and smart card including this printed circuit.

Abstract: Method for the manufacture of a chip card module in which a polymer material including conductive particles is deposited in two connection wells or on two conductive pads formed in a conductive sheet positioned on the back face of the module. This polymer material forms, after deposition, an excess thickness on the back face which comes, during the insetting of the module, into contact with the ends of an antenna. Between the manufacture of the modules and their insetting, the modules are positioned on a strip which can be rolled up on itself for the purpose of its storage.

Abstract: The present invention provides for a prelam body of a smart card, a smart card, a method of forming a prelam body of a smart card, and a method of forming a smart card. In accordance with some embodiments herein, a prelam body comprises a base substrate formed of at least one layer, and at least one overlay sheet layer formed on one side of the base substrate, wherein the at least one overlay sheet layer has a recess formed therein. The recess is at least partially extending through the at least one overlay sheet layer such that an opening of the recess is exposed.

Abstract: Electrical circuit for a smart card chip module, including an insulating layer having a front main face and a rear main face. An antenna is made in a first conductive layer laying on the rear main face. This antenna extends over an antenna area delimited by a peripheral edge. The antenna includes at least one inner loop and one outer loop. The outer loop runs along the peripheral edge except over at least one first connecting segment diverted from the peripheral edge, towards or in a central zone of the antenna area. Further, the outer loop of the antenna includes at least a second connecting segment diverted from the peripheral edge towards a central zone of the antenna area.

Abstract: When forming smartcards or pre-forms thereof additional functionality may be implemented by, for instance, incorporating components, such as a display device, and the like, by preparing pre-packages separately from the rest of the pre-forms and subsequently inserting the pre-packages into the pre-forms, thereby achieving superior process robustness and production yield.

Abstract: An antenna for a radio frequency identification transponder includes an electrically conductive main portion, an electrically conductive first transverse portion and an electrically conductive second transverse portion. The first and second transverse portions are connected to opposite portions of the main portion, extend in an antenna width direction and are spaced apart from each other in an antenna length direction. The antenna further includes an electrically conductive first tail portion extending in the antenna length direction and being connected to an end of the first transverse portion distal of the main portion. The main portion includes a loop and a plurality of meanders. The loop includes a pair of contacts configured for connecting the antenna to a radio frequency identification chip. An extension of the meanders in the antenna width direction is smaller than an extension of the loop in the antenna width direction.

Abstract: In an aspect, the present invention provides a document, comprising an RFID inlay, a shield element and a support portion, wherein the shield element, the support portion, and the RFID inlay are provided in a stack configuration. Herein, the shield element and an antenna of the RFID inlay are only partially overlapping each other.

Abstract: The present invention relates in various aspects to a module for integrating into card body of a smart card, to a smart card, and to a method of implanting a module into a card body of a smart card. In an aspect, a module for integrating into a card body of a smart card comprises a support, a contact portion formed on a first surface of the support, and a solder material formed on the contact portion, wherein a surface of the solder material is at least partially covered by a flux.

Abstract: In various aspects, the present invention relates to a lead frame for integration into a smart card, a card body of a smart card, a smart card, and a method of forming a smart card. In an aspect of the present disclosure, a lead-frame for integration into a smart card is provided comprising a planar lead-frame body portion, at least one contact pad having a planar contact portion, and at least one bridging portion coupled with the planar lead-frame body portion and extending away from the planar lead-frame body towards the at least one contact pad and between the planar contact portion and the planar lead-frame portion, wherein the at least one bridging portion extending out of a plane defined by at least one of the planar lead-frame body portion and the planar contact portion and at least partially in parallel to a substantially normal direction of the planar contact portion.

Abstract: The present disclosure provides in various aspects for a prelam body of a smart card, a method of forming a prelam body of a smart card, and a smart card having a card body with such a prelam body. According to some embodiments herein, a prelam body of a smart card comprises a prelam body substrate having an IC landing area provided on a first main surface of the prelam body substrate, the IC landing area having at least one contact pad and at least one dummy island, wherein the at least one contact pad is electrically coupled with at least one conductive line routed in or on the prelam body substrate, and a chip having at least one contact element arranged on a second main surface of the chip, wherein the at least one contact element is in electric connection with the at least one contact pad. The chip is flip-chip bonded to the prelam body substrate such that the first main surface and the second main surface face each other and that the chip at least partially overlies the at least one contact pad.

Abstract: The present invention relates to card-type information substrates, such as payment cards, and a pre-form thereof, in which a frame, in some embodiments in combination with a metal containing plate, is implemented so as to impart increased weight and/or superior appearance to the card-type substrates, wherein the influence of the frame and the metal containing plate, if provided, on the RF performance of the card-type substrate is taken into consideration. For example, in illustrative embodiments the influence of a conductive material in the frame and/or the plate is reduced by selecting one or more appropriate features countering the negative effect on the RF performance.

Abstract: Biometric sensor module for a chip card, and method for producing such a module. Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, both forming main faces of the carrier, attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area on the front face, producing electrically conductive connection pads on the back face of the carrier which are electrically connected to the biometric sensor, at least one connection pad includes a region that is wettable with a solder material, extending over an area of between 0.2 and 5 square millimetres.

Abstract: The present invention relates to card-type information substrates, such as payment cards, in which a frame is implemented so as to impart increased weight and/or superior appearance to the card-type substrates, wherein the influence of the frame on the RF performance of the card-type substrate is taken into consideration. For example, in illustrative embodiments the influence of a conductive material in the frame is reduced by selecting one or more appropriate features countering the negative effect on the RF performance.

Abstract: The present disclosure provides in various aspects for a method of forming a prelam body of a smart card and a prelam body of a smart card. In some illustrative embodiments, a prelam body of a smart card comprises at least one contact terminal patch, which comprises a patch base layer and a plurality of conductive pads provided on a surface of the patch base layer, wherein the plurality of conductive pads is arranged on the patch base layer in accordance with a predefined interconnection design, and a prelam sheet with a plurality of openings, each opening accommodating a dedicated one of the conductive pads, wherein the at least one contact terminal patch is mounted to the prelam sheet.