Patents Assigned to Linxens Holding
  • Patent number: 12361257
    Abstract: Electrical circuit for a smart card chip module, including an insulating layer having a front main face and a rear main face. An antenna is made in a first conductive layer laying on the rear main face. This antenna extends over an antenna area delimited by a peripheral edge. The antenna includes at least one inner loop and one outer loop. The outer loop runs along the peripheral edge except over at least one first connecting segment diverted from the peripheral edge, towards or in a central zone of the antenna area. Further, the outer loop of the antenna includes at least a second connecting segment diverted from the peripheral edge towards a central zone of the antenna area.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: July 15, 2025
    Assignee: Linxens Holding
    Inventors: Yean Wei Yeap, Wen Qiang Chin
  • Patent number: 12131987
    Abstract: Biometric sensor module for a chip card, and method for producing such a module. Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, both forming main faces of the carrier, attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area on the front face, producing electrically conductive connection pads on the back face of the carrier which are electrically connected to the biometric sensor, at least one connection pad includes a region that is wettable with a solder material, extending over an area of between 0.2 and 5 square millimetres.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: October 29, 2024
    Assignee: Linxens Holding
    Inventors: Christophe Mathieu, Carsten Nieland
  • Patent number: 12106168
    Abstract: Method for the electrochemical metallization of a double-sided electrical circuit for a chip card. Contacts and current leads are located on a front face. An antenna and connection pads are located on a rear face. This method includes an operation of electrochemically depositing at least one layer of electrically conductive material on connection pads, while supplying these connection pads with current via the current leads, contacts and metallized holes establishing electrical continuity between the front face and the rear face. This method furthermore includes, after the operation of electrochemically depositing at least one layer of electrically conductive material, an operation of electrically isolating at least one metallized hole from a connection pad. Electrical circuit obtained using this method.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: October 1, 2024
    Assignee: Linxens Holdings
    Inventors: Nicolas Michaudet, Thierry Dumont
  • Patent number: 11894295
    Abstract: Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: February 6, 2024
    Assignee: Linxens Holding
    Inventors: Christophe Mathieu, Guillaume Gimbert
  • Patent number: 11775794
    Abstract: Biometric sensor module for a chip card, and method for producing such a module Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, the front face being coated with an electrically conductive layer in which a bezel is formed, at least one conductive via being made in the thickness of the carrier to electrically connect the bezel to the back face, producing a protective layer on the front face, covering a protection area located inside the bezel, and attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite the protection area.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: October 3, 2023
    Assignee: Linxens Holding
    Inventors: Christophe Mathieu, Claire Laurens De Lopez
  • Patent number: 11640514
    Abstract: The invention relates to a chip card designed to communicate data in a contactless mode with a card reader operating at a reading frequency. The resonance frequency of the chip card may change according to the capacitance of the chip used in the contactless mode of the chip card. In order to be able to use various chips without changing the booster antenna design, the card antenna circuit is provided with a capacitance element such that the chip card including the card antenna circuit and the chip module has two different resonance frequencies, one of which being equal to, or lower than, the reading frequency and the other being equal to, or greater, than the reading frequency. This create a broadband wherein the reading frequency falls.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: May 2, 2023
    Assignee: Linxens Holding
    Inventors: Yean Wei Yeap, Minli Cindy Ng, Wen Qiang Chin
  • Patent number: 11412620
    Abstract: The invention relates to a process for manufacturing a roll of flexible carrier bearing electronic components. This process includes a step consisting in adding, to this flexible carrier, electronic components, themselves manufactured from a roll of flexible initial substrate. For example, the electronic components may be manufactured on an initial substrate having a width allowing advantage to be taken of densification of the manufacture of the components on this initial substrate. Subsequently, the singulated electronic components are added to the flexible carrier, allowing, for example, packaging that is more suitable, than possible with the initial substrate, to a use of the electronic components, notably when the latter must be integrated into a chip-card. Thus, for example, the flexible carrier may be, or include, an adhesive, which may or may not be conductive, and which is used to fasten, and optionally connect, each electronic component to a chip-card.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: August 9, 2022
    Assignee: Linxens Holding
    Inventor: Christophe Mathieu
  • Patent number: 11047060
    Abstract: An electrical circuit, for example a printed circuit, for producing a module for integration into a card such as a chip card. This module includes electrical contact or connector which includes lands for the connection and communication of the chip with a read/write system. To give them a white color, or a color close to white, these electrical contact lands are at least partially covered with a layer of a rhodium alloy. The invention also relates to a method for manufacturing such an electrical circuit.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: June 29, 2021
    Assignee: Linxens Holding
    Inventors: Hugues Nsalambi, Florian Venon, Jérome Sanson, Guillaume Cardoso
  • Patent number: 10810477
    Abstract: The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: October 20, 2020
    Assignee: Linxens Holding
    Inventors: Christophe Mathieu, Bertrand Hoveman
  • Patent number: 10804226
    Abstract: The invention relates to a chip card manufacturing method. According to this method, there are produced on the one hand, a module including a substrate supporting contacts on one face, and bonding pads on the other, on the other hand, an antenna on a support. The ends of the antenna are linked to lands of connection lands receiving a drop of soldering material on a connection portion. In order to make the soldered electrical connection between the module and the antenna reliable, the bonding pads extend over a zone covering a surface area less than that of the connection portions. The invention relates also to a chip card whose module includes bonding pads extending over a zone covering a surface area less than that of the connection portions.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: October 13, 2020
    Assignee: Linxens Holding
    Inventors: Cyril Proye, Eric Eymard
  • Patent number: 10740670
    Abstract: The invention relates to a method for fabricating chip cards. According to this method, an antenna and a chip card module are provided. This chip card module includes a dielectric substrate and conducting tracks at least on a face of this substrate. A connection unit is used to establish a connection between the antenna and conducting tracks of the module. The invention also relates to a method for fabricating an antenna support including such a connection unit. The invention also relates to a chip card and an antenna support which are obtained by the aforementioned methods.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: August 11, 2020
    Assignee: Linxens Holding
    Inventors: Cyril Proye, Valerie Mousque, Christophe Paul
  • Patent number: 10706346
    Abstract: The invention relates to a method for producing a chip card module. According to this method, the following are produced: a module with a substrate having contacts and an electronic chip connected to at least some contacts; an antenna on a carrier, this antenna including two ends, each equipped with a connection land; a cavity in at least one layer of the card at least partially covering the carrier, in order to house the module and to expose the connection lands of the antenna; a first end of a wire is connected directly to a connection pad of the chip, and another portion is connected directly to a connection land of the antenna, after having inserted the module into the cavity.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: July 7, 2020
    Assignee: Linxens Holding
    Inventor: Eric Eymard
  • Patent number: 10592796
    Abstract: A chip card manufacturing method. A module includes a substrate supporting contacts on one surface and conductive paths and a chip on another; and an antenna on a holder, the antenna including a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of the contact pads of the antenna. The holder of the antenna is inserted between plastic layers. A cavity is provided, in which the module can be accommodated and the solder drops remain accessible. The height of the solder drops before heating is suitable for projecting into the cavity. A module is placed in each cavity. The areas of the module that are located on the solder drops are heated to melt the solder and to solder the contact pads of the antenna to conductive paths of the module.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: March 17, 2020
    Assignee: Linxens Holding
    Inventors: Eric Eymard, Cyril Proye, Nicolas Guerineau, Christophe Paul
  • Patent number: 10417548
    Abstract: The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: September 17, 2019
    Assignee: Linxens Holding
    Inventors: Christophe Mathieu, Bertrand Hoveman
  • Patent number: 10102470
    Abstract: The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a color appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a coloring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: October 16, 2018
    Assignee: Linxens Holding
    Inventors: Mara Coppola, Yannick De Maquille, Fabien Marcq
  • Patent number: 9799598
    Abstract: Method for producing at least one electronic chip support, from a plate that includes a first face intended to be in contact with a chip reader, a second face, covered with a first layer of electrically conductive material and intended to be linked to a radio antenna, and a core made from an electrically insulating material separating the first face from the second face. This method includes steps of drilling at least one through hole through the plate, depositing a layer of electrically conductive material on the first face and chemically etching a first electric circuit and a second electric circuit on the first face and the second face respectively. Prior to the chemical etching step, a step of depositing a third layer of electrically conductive material in the hole or holes, which covers the electrically insulating material in the corresponding hole or holes.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: October 24, 2017
    Assignee: Linxens Holding
    Inventor: Eric Eymard
  • Publication number: 20170270398
    Abstract: The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.
    Type: Application
    Filed: May 13, 2015
    Publication date: September 21, 2017
    Applicant: Linxens Holding
    Inventors: Christophe MATHIEU, Bertrand HOVEMAN
  • Patent number: 9583459
    Abstract: The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive material insulated from each other by a layer of insulating material, connection holes extending through the layer of insulating material and blocked by one of the layers of electrically conductive material, an area free of conductive material being provided in the other layer of electrically conductive material around the connection holes. The invention also concerns a printed circuit for a chip card produced using this method and a chip card module including such a printed circuit.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: February 28, 2017
    Assignee: Linxens Holding
    Inventors: Severine Dieu-Gomont, Bertrand Hoveman
  • Patent number: 9572265
    Abstract: The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: February 14, 2017
    Assignee: Linxens Holding
    Inventors: Séverine Dieu-Gomont, Francois Lechleiter, Yannick De Maquillé
  • Patent number: 9508905
    Abstract: The inventions relates to a method of manufacturing a circuit incorporating a solid state light emitting component, the method including providing an insulating layer, producing at least one through hole in the insulating layer, providing a conductive layer, bonding a main surface of the conductive layer to the insulating layer, and positioning at least one solid state light emitting component in the hole of the insulating layer and connecting this component to the conductive layer.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: November 29, 2016
    Assignee: Linxens Holding
    Inventors: Francois Lechleiter, Pierre-Alois Welsch, Yannick de Maquille