Abstract: A method for forming a package includes: molding a semiconductor chip and a light-emitting element; forming a redistribution layer (RDL) which electrically connects the semiconductor chip to the light-emitting element; and arranging a light-receiving element on the redistribution layer to be electrically connected thereto. The light-receiving element is arranged such that at least a portion thereof is located directly above the semiconductor chip.

Abstract: There is provided a semiconductor package. The semiconductor package includes: a semiconductor chip; a mold configured to encapsulate the chip; a redistribution layer; and an optical device electrically connected to the chip through the redistribution layer. The mold is formed with an optical path passing through the mold, and light is input to or output from the optical device through the optical path.

Abstract: Provided is an optical element module comprising: a mold body having a first surface formed on an upper portion thereof and a second surface formed on a lower portion thereof; an external connection terminal formed on the first surface and electrically connected to the outside; an optical engine embedded and sealed between the first surface and the second surface and having a connection pad exposed to the second surface; a conductive vertical via formed to penetrate the first surface and the second surface and having one end portion electrically connected to the external connection terminal; a wiring layer formed on the second surface to interconnect the other end of the conductive vertical via and the connection pad of the optical engine; and a reflective surface integrally formed on the wiring layer and transmits an optical signal generated by the optical engine or received by the optical engine.

Abstract: Provided are a subminiature optical transmission module and a method for manufacturing same. The optical transmission module includes: a mold body having a first surface and a second surface opposite to each other; multiple edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in the edge direction of a chip; and an optical component disposed on one side thereof so as to optically multiplex multiple optical signals incident from the multiple edge-type light emitting elements and to output same, wherein the identical height is configured between the surface of each light emitting element and the optical axis of the optical component, and the edge direction of the chip is parallel to the first surface of the mold body.

Abstract: Provided is a connector plug includes: an optical device module having an optical engine that generates an optical signal or receives an optical signal; an optical fiber alignment guide member having an optical fiber insertion channel formed on one surface of the optical device module so that optical fibers are seated; and an optical component that is seated in an optical component alignment guide groove formed adjacent to the optical fiber alignment guide member on one surface of the optical device module, wherein the optical engine includes an optical device which is formed adjacent to the optical component on one surface of the optical device module, and which radiates an optical signal or receives an optical signal in the horizontal direction, and an optical integrated circuit (IC) installed in the optical device module and controlling the optical device.

Abstract: There is provided a semiconductor package. The semiconductor package includes: a semiconductor chip; a mold configured to encapsulate the chip; a redistribution layer; and an optical device electrically connected to the chip through the redistribution layer. The mold is formed with an optical path passing through the mold, and light is input to or output from the optical device through the optical path.

Abstract: A method for forming a package includes: molding a semiconductor chip and a light-emitting element; forming a redistribution layer (RDL) which electrically connects the semiconductor chip to the light-emitting element; and arranging a light-receiving element on the redistribution layer to be electrically connected thereto. The light-receiving element is arranged such that at least a portion thereof is located directly above the semiconductor chip.

Abstract: Provided is an optical element module comprising: a mold body having a first surface formed on an upper portion thereof and a second surface formed on a lower portion thereof; an external connection terminal formed on the first surface and electrically connected to the outside; an optical engine embedded and sealed between the first surface and the second surface and having a connection pad exposed to the second surface; a conductive vertical via formed to penetrate the first surface and the second surface and having one end portion electrically connected to the external connection terminal; a wiring layer formed on the second surface to interconnect the other end of the conductive vertical via and the connection pad of the optical engine; and a reflective surface integrally formed on the wiring layer and transmits an optical signal generated by the optical engine or received by the optical engine.

Abstract: Provided are a slim connector plug capable of transmitting and receiving a large amount of data at an ultra-high speed and implementing a miniaturized and slimmed structure with a thickness of 1 mm while being manufactured at low cost, and an active optical cable (AOC) assembly using the same. The connector plug includes: an optical sub-assembly in which an optical fiber seating groove on which an optical fiber is mounted is formed on one side of the optical sub-assembly and a reflective surface is formed on an inner end of the optical fiber seating groove; an optical element module having an optical engine stacked on the optical sub-assembly and generating an optical signal or receiving an optical signal; and an optical component installed on the reflective surface of the OSA and transmitting the optical signal between the optical fiber and the optical engine.

Abstract: A semiconductor package including: a chip having a first surface and a second surface; a mold configured to encapsulate the chip; a vertical conductive channel electrically connected to a pad formed on the second surface of the chip while passing through the mold; a wiring pattern electrically connected to a pad formed on the first surface of the chip and configured to perform electrical connection in the package; an optical device arranged on a surface of the semiconductor package to be electrically connected to the vertical conductive channel; and an external connection terminal configured to electrically connect the semiconductor package to the outside.

Abstract: A semiconductor package including: a chip having a first surface and a second surface; a mold configured to encapsulate the chip; a vertical conductive channel electrically connected to a pad formed on the second surface of the chip while passing through the mold; a wiring pattern electrically connected to a pad formed on the first surface of the chip and configured to perform electrical connection in the package; an optical device arranged on a surface of the semiconductor package to be electrically connected to the vertical conductive channel; and an external connection terminal configured to electrically connect the semiconductor package to the outside.

Abstract: A semiconductor package including: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside.