Abstract: The wiring length measurement apparatus includes a distance calculation unit, by using a plurality of coordinates of bending points and a wiring width of CAD data of a high-density wiring including a meander wiring, seeking each endpoint that exists on an edge in a wiring width direction and is a flexion point of each inner circuit side, and calculating distances between each adjacent endpoint and a measurement unit measuring a wiring length of the high-density wiring by calculating a sum of the distances between each endpoint calculated by the distance calculation unit.

Abstract: An illumination device includes a metal base substrate in a flat planar shape, a plurality of LED modules, and a driving unit which drives each of the LEDs arranged on the metal base substrate. The LED modules have an organic substrate, a plurality of LEDs which are arranged on the organic substrate, a metal member, LED control signal terminals which are set on the edge of the organic substrate, and voltage feed terminals which are set on the edge of the organic substrate. The metal member corresponds to each LED and to which the heat from the LEDs is conducted, and which is electrically connected via a switch element from an electrode of the LED, and which penetrates the organic substrate toward its width direction from the LED mounting surface of the organic substrate and is exposed from the opposite surface.

Abstract: A semiconductor device includes an Si substrate having a first surface provided with semiconductor elements, such as a CMOS transistor and a diode, and a second surface opposite to the first surface. On one of the first and the second surfaces, a bypass capacitor is formed. The bypass capacitor includes a Vcc power supply layer and a GND layer which serve to supply a power supply voltage to the semiconductor element, and a high dielectric constant layer sandwiched between the Vcc power supply layer and the GND layer.

Abstract: A BSC macrostructure for three-dimensional wiring includes a BSC (boundary scan cell) and an aperture electrode for electrode connection which is connected to the BSC.

Abstract: A wiring structure of a substrate adapted to mount a plurality of integrated circuits has a signal wire for connecting the integrated circuits to each other, first and second power supply layers faced to each other, and return path wires arranged generally in parallel to the signal wire. One of the return path wires has opposite terminal ends connected to the first power supply layer (Vcc layer). The other return path wire has opposite terminal ends connected to the second power supply layer (GND layer).