Abstract: A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eutectic gallium alloy and gallium oxide has a weight percentage (wt %) of between about 59.9% and about 99.9% eutectic gallium alloy, and a wt % of between about 0.1% and about 2.0% gallium oxide. Also disclosed are articles of manufacture, comprising the shear thinning gel composition, and methods of making article of manufacture having a shear thinning gel composition. Also disclosed are sensors and multiplexed systems utilizing deformable conductors.

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Abstract: A human interface device may include a deformable body having a handle portion, and a deformable conductor coupled to the deformable body and arranged to deform in response to a physical manipulation of the deformable body. The physical manipulation may include compressing, flexing, twisting, and/or stretching at least a portion of the deformable body. The deformable conductor may be arranged to change an electric characteristic such as a resistance, capacitance and/or inductance in response to the physical manipulation. The deformable conductor may include a sensor portion, and a transmission portion. The sensor portion may sense a first type of physical manipulation, and the transmission portion may sense a second type of physical manipulation.

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Abstract: A conductive assembly may include a deformable substrate disposed around an axis, and a deformable conductor arranged on the deformable substrate. The substrate may be arranged to form a channel along the axis, and the deformable conductor may be arranged on the deformable substrate to form a waveguide. The deformable substrate, the first deformable conductor, and a second deformable conductor may be arranged to form a microstrip or a coaxial transmission line. A deformable transmission line may include a deformable substrate arranged in a substantially enclosed channel around an axis, a first deformable conductor arranged in a trace along the axis of the deformable substrate, and a second deformable conductor arranged on the deformable substrate to form a reference conductor for the first deformable conductor. A method of fabricating a deformable conductive assembly may include forming a deformable conductor on a deformable substrate, and disposing the deformable substrate around an axis.

Abstract: A sensor may include a deformable sensing element having a deformable conductor arranged to deform in response to deformation of the sensing element, wherein the deformation of the sensing element is selectively controlled. The sensing element may be selectively controlled by a restraining element. The restraining element may control the deformation of the sensing element by distributing forces applied to the sensing element. The sensing element may include a deformable body with the deformable conductor arranged to respond to elongation of the deformable body. The deformable conductor may include a conductive gel. A sensor may include a deformable body, a deformable conductor arranged to deform in response to deformation of the deformable body, and a restraining element arranged to selectively control the deformation of the deformable body.

Abstract: A deformable assembly may include a first structural layer, a first bonding layer bonded to the structural layer, and a pattern of functional material entrapped between the first structural layer and first the bonding layer. The functional material has a viscous characteristic, an elastic characteristic and/or a viscoelastic characteristic. The assembly may further include a second structural layer bonded to the first bonding layer. The first structural layer may include a first piece of fabric, the second structural layer may include a second piece of fabric, and the functional material may be electrically conductive. The functional material may include a conductive gel. The assembly may further include a second bonding layer bonded to the first bonding layer and the first structural layer, and the pattern of functional material may be entrapped between the first and second bonding layers.

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

Abstract: A sensor may include a bladder, and a deformable conductor disposed on the bladder such that deformation of the bladder causes deformation of the deformable conductor, wherein the bladder is constrained so as to enhance the deformation of the conductor in response to the deformation of the bladder. A method may include applying a stimulus to a bladder having a deformable conductor attached thereto, detecting a change in an electrical characteristic associated with the deformable conductor in response to the stimulus, and selectively constraining the bladder to amplify the change in electrical characteristic in response to the stimulus.

Abstract: A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eutectic gallium alloy and gallium oxide has a weight percentage (wt %) of between about 59.9% and about 99.9% eutectic gallium alloy, and a wt % of between about 0.1% and about 2.0% gallium oxide. Also disclosed are articles of manufacture, comprising the shear thinning gel composition, and methods of making article of manufacture having a shear thinning gel composition. Also disclosed are sensors and multiplexed systems utilizing deformable conductors.

Abstract: A sensor may include a bladder, and a deformable conductor disposed on the bladder such that deformation of the bladder causes deformation of the deformable conductor, wherein the bladder is constrained so as to enhance the deformation of the conductor in response to the deformation of the bladder. A method may include applying a stimulus to a bladder having a deformable conductor attached thereto, detecting a change in an electrical characteristic associated with the deformable conductor in response to the stimulus, and selectively constraining the bladder to amplify the change in electrical characteristic in response to the stimulus.

Abstract: A method may include providing a fluid material, solidifying the fluid material, providing a substrate, and depositing the solidified fluid material on the substrate. Providing the fluid material may include providing a mold, and filling the mold with the fluid material. Solidifying the fluid material may include solidifying the fluid material in a mold, and removing the solidified fluid material from the mold. Providing the substrate may include preparing the substrate for deposition of the solidified fluid material, and adjusting the temperature of the substrate. Depositing the solidified fluid material on the substrate may include fixturing the substrate, and loading the solidified fluid material in a deposition tool. The fluid material may include a liquid phase component, and a solid phase component. The solid phase component may include particles suspended in the liquid phase component. The liquid phase component may include a gallium alloy.

Abstract: A circuit assembly may include a first layer arranged as a substrate, a second layer having a spiral pattern attached to the substrate, wherein the spiral pattern contains a deformable conductor. A circuit assembly may include a first portion of a deformable inductor fabricated on a first layer of the circuit assembly; and a second portion of the deformable inductor fabricated on a second layer of the circuit assembly and electrically connected to the first portion of the deformable inductor. A method may include sensing an interaction with a deformable inductor, wherein the deformable inductor may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor. An article of manufacture may include an inductive pattern of deformable conductor, and a deformable substrate arranged to support the inductive pattern of deformable conductor.

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

Abstract: A sensor may include a deformable sensing element having a deformable conductor arranged to deform in response to deformation of the sensing element, wherein the deformation of the sensing element is selectively controlled. The sensing element may be selectively controlled by a restraining element. The restraining element may control the deformation of the sensing element by distributing forces applied to the sensing element. The sensing element may include a deformable body with the deformable conductor arranged to respond to elongation of the deformable body. The deformable conductor may include a conductive gel. A sensor may include a deformable body, a deformable conductor arranged to deform in response to deformation of the deformable body, and a restraining element arranged to selectively control the deformation of the deformable body.

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

Abstract: A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eutectic gallium alloy and gallium oxide has a weight percentage (wt %) of between about 59.9% and about 99.9% eutectic gallium alloy, and a wt % of between about 0.1% and about 2.0% gallium oxide. Also disclosed are articles of manufacture, comprising the shear thinning gel composition, and methods of making article of manufacture having a shear thinning gel composition. Also disclosed are sensors and multiplexed systems utilizing deformable conductors.

Abstract: A conducting shear thinning gel composition and methods of making such a composition are disclosed. The conducting shear thinning gel composition includes a mixture of a eutectic gallium alloy and gallium oxide, wherein the mixture of eutectic gallium alloy and gallium oxide has a weight percentage (wt %) of between about 59.9% and about 99.9% eutectic gallium alloy, and a wt % of between about 0.1% and about 2.0% gallium oxide. Also disclosed are articles of manufacture, comprising the shear thinning gel composition, and methods of making article of manufacture having a shear thinning gel composition. Also disclosed are sensors and multiplexed systems utilizing deformable conductors.