Abstract: A projection device and a household appliance are provided. The projection device includes a casing, a lens component, and a pattern lighting module. An opening is disposed at a front end of the casing. The lens component is disposed inside an accommodating space of the casing and fixed on the casing, and the lens component corresponds to the opening. The pattern lighting module is disposed inside the accommodating space of the casing and fixed on the casing, and the pattern lighting module corresponds to the lens component. The pattern lighting module emits at least one patterned light beam that passes through the lens component and the opening sequentially.

Abstract: A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.

Abstract: A package structure is provided. The package structure includes a substrate, a pair of electrodes, a lighting unit, a wall, and a package compound. The pair of electrodes and the wall are disposed on the substrate, and the wall and the substrate jointly define an accommodating space. The lighting unit is disposed in the accommodating space. The package compound is disposed in the accommodating space such that a top end of the package compound has a W-shaped cross section and the lighting unit is embedded in the package compound.

Abstract: A light-emitting keyboard includes a bracket, a keycap, a circuit layer, a composite light-emitting layer and a spacing layer. The bracket has an opening. The keycap is disposed on the bracket and connected to the bracket via a support assembly. The circuit layer is disposed between the keycap and the bracket. The composite light-emitting layer is disposed under the bracket, and includes a substrate, a circuit disposed on the substrate and a light source located under the keycap and electrically connected to the circuit, wherein light emitted from the light source is transmitted upwardly to the keycap. The spacing layer is disposed between the composite light-emitting layer and the bracket, wherein the spacing layer includes a hole corresponding to the opening of the bracket, and the light source is located in the hole of the spacing layer.

Abstract: A backlight module including a light guide plate, a circuit board, an electronic component, a reflective sheet, a light-shielding sheet, and a light-emitting component is provided. The light guide plate includes an escape opening. The circuit board is disposed under the light guide plate. The electronic component is disposed on the circuit board, and at least a part of the electronic component is located in the escape opening. The reflective sheet is disposed on the rear surface of the light guide plate and between the light guide plate and the circuit board, and the reflective sheet extends into the escape opening. The light-shielding sheet is disposed on the light emitting surface of the light guide plate opposite to the rear surface. The light-emitting component is disposed on the light guide plate. A luminous keyboard using this backlight module is also provided.

Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: A light emitting device is provided. The light emitting device includes a package structure, a first light emitting chip, a second light emitting chip, a third light emitting chip, a first encapsulant, a second encapsulant, and a third encapsulant. The first light emitting chip, the second light emitting chip, and the third light emitting chip are disposed in a first cavity, a second cavity, and a third cavity of a body of the package structure, and electrically connected with a first electrode pair, a second electrode pair, and a third electrode pair that are covered by the body. The first encapsulant, the second encapsulant, and the third encapsulant are filled in the first cavity, the second cavity, and the third cavity. A first opening of the first cavity is larger in size than a second opening of the second cavity and a third opening of the third cavity.

Abstract: The disclosure provides a keyboard including a bottom plate, a key unit and a shielding layer. The bottom plate includes a through hole. The key unit is disposed on the bottom plate. The shielding layer covering a portion of the bottom plate includes a main part and an extension part extending from the main part toward the through hole. The shielding layer is provided with a black surface, and an orthographic projection of the key unit on the shielding layer overlaps the black surface.

Abstract: An input apparatus includes a reflection layer, a light guide plate, a first light source, a second light source and a light absorption member. The light guide plate is disposed on the reflection layer and includes a first light guide region and a second light guide region connected with each other by a junction, a first area of the first light guide region is different from a second area of the second light guide region. The first light source corresponds to the first light guide region. The second light source corresponds to the second light guide region, the light guide plate has a first opening structure disposed between the first light source and the second light source. The light absorption member is disposed at a position corresponding to the first opening structure.

Abstract: An optical sensor structure is provided. The optical sensor structure includes a substrate, a light sensing unit, a peripheral wall, and a reflective layer. The substrate includes a plurality of metal pads. The light sensing unit is disposed on the substrate and electrically connected to the plurality of metal pads. The peripheral wall is disposed on the substrate, and the peripheral wall and the substrate define an accommodating space. The metal pads and the light sensing unit are positioned in the accommodating space. The reflective layer is disposed in the accommodating space and surrounds the light sensing unit.

Abstract: A light-emitting device, a display module, and a driving method thereof are disclosed. The light-emitting device including a data input, a data output, a plurality of light units, and a driving circuit. The data input is configured to receive an input data. The data output is adapted to be connected in series to a data input of another light-emitting device. The driving circuit is coupled to the data input, the data output, and the plurality of light units. The driving circuit statically drives the plurality of light units according to the input data, and generates an output data according to the input data and transmits the output data to the data output. The display module includes the light-emitting device and a control circuit.

Abstract: A transistor heat dissipation module is adapted for at least one transistor. The transistor heat dissipation module includes a heat dissipation member and an elastic member. The heat dissipation member includes a first wall and a second wall opposite to each other and a first connecting member connected to the first wall and the second wall. An accommodating space is formed between the first wall and the second wall. The transistor is disposed in the accommodating space. The elastic member is disposed in the accommodating space and is located between the at least one transistor and the first wall to press the at least one transistor against the second wall. An assembly method of a transistor heat dissipation module is further provided.

Abstract: A computation device, a sensing device and a processing method based on time-of-flight (ToF) ranging are provided. In the method, intensity information of at least two phases corresponding to at least one pixel is obtained. The intensity information is generated by sensing a modulation light with time delays using these phases. Whether to abandon the intensity information of the at least two phases corresponding to the pixel is determined according to the difference between the intensity information of the at least two phases. Accordingly, the influence caused by motion blur would be reduced on depth information estimation.

Abstract: A light emitting structure includes a substrate, at least one light emitting chip disposed on the substrate and, a side wall disposed on the substrate and surrounding the at least one light emitting chip, a cover disposed on the side wall, an anti-reflective coating disposed on the cover, and a protective layer disposed on outside of the cover, wherein the cover, the side wall and the substrate define an enclosed space for accommodating the at least one light emitting chip.

Abstract: A light emitting package is provided, the light emitting package includes a carrier having a main part that has multiple chip bonding regions, and each the chip bonding regions has two neighboring conductive parts. An insulating part is disposed on the main part and portion of the two neighboring conductive parts, and multiple hollow-out structures are formed by the insulating part and corresponded in position to the chip bonding regions. Each of the hollow-out structures has a side wall that surrounds the chip bonding regions, and the portion of the tops of the two neighboring conductive parts are exposed from a bottom portion of the hollow-out structure, and multiple light emitting chips are disposed onto the chip bonding surfaces.

Abstract: A key assembly includes a bottom plate, a keycap disposed on the bottom plate, an elastic member disposed between the bottom plate and the keycap, a link member, and a protruding member. The keycap has an inner surface facing the bottom plate and includes a link member pivoting portion protruding from the inner surface. The link member pivoting portion has a pivot hole and an opening communicating with the pivot hole and away from the inner surface. A size of the opening is smaller than a size of the pivot hole. The link member is rotatably disposed in the pivot hole. The protruding member is disposed between the inner surface of the keycap and the link member. The link member is supported by the protruding member and contacts a part of the link member pivoting portion near the opening on a wall surface surrounding the pivot hole.

Abstract: An optoelectronic module, including a substrate, a covering member, a light emitting element, and a light receiving element, is provided. The covering member is disposed on the substrate and includes an upper cover portion, a peripheral sidewall portion connected to the upper cover portion, and an inside partition delimiting a first cavity and a second cavity. The first cavity is separated from the second cavity. The light emitting element is disposed on the substrate as corresponding to the first cavity. The light receiving element is disposed on the substrate as corresponding to the second cavity. The inside partition has a first inner wall surface located in the first cavity and a second inner wall surface located in the second cavity. A first protruded-recessed structure is formed on the first inner wall surface.

Abstract: A keyboard includes a backlight module, a base plate, a membrane circuit disposed on the base plate, and a plurality of key structures disposed on the membrane circuit. The backlight module includes a light source, a reflective layer, a light guide layer, and a shielding layer. The light source is disposed corresponding to the light guide layer. The light guide layer is located between the shielding layer and the reflective layer. The light guide layer has a through-hole. The shielding layer and the reflective layer are in contact with each other in the through-hole of the light guide layer. The base plate is disposed on the shielding layer. The base plate has a positioning portion disposed corresponding to the through-hole of the light guide layer, which protrudes toward the reflective layer or the membrane circuit.

Abstract: A light-emitting package structure and a manufacturing method thereof are provided. The light-emitting package structure includes a driving device and at least one light-emitting chip. The driving device includes a driving chip and a redistribution layer structure formed over the driving chip. The driving chip has a first surface and a second surface opposite to the first surface. The redistribution layer structure includes a plurality of first conductive pads disposed on the first surface and a plurality of second conductive pads disposed on the second surface, and one of the first conductive pads is electrically connected to one of the second conductive pads. The at least one light-emitting chip is disposed on the first surface of the driving chip and electrically connected to the driving chip through the first conductive pads.

Abstract: The disclosure provides a keyboard includes a bottom plate, a key unit and a shielding layer. The bottom plate includes a body part and a through hole. The key unit is disposed on the body part. The shielding layer covers a portion of the bottom plate and comprising a main part disposed on the body part and an extension part extending from the main part toward the through hole, wherein the extension part has a hole with a size larger than or substantially equal to a size of the through hole.