Patents Assigned to LITE-ON TECHNOLOGY CORPRATION
  • LEAD FRAME STRUCTURE, A PACKAGING STRUCTURE AND A LIGHTING UNIT THEREOF
    Publication number: 20120074451
    Abstract: A lead frame structure, a packaging structure and a lighting unit are disclosed. The lead frame structure includes at least two first lead frame units having a space therebetween, and the two first lead frame units are arranged in an opposite manner. Each the first lead frame unit has a first conducting portion, a second conducting portion, and a first connection portion between the first and the second conducting portions. Moreover, the first connection portion has at least two grooves on a surface thereof.
    Type: Application
    Filed: May 13, 2011
    Publication date: March 29, 2012
    Applicants: LITE-ON TECHNOLOGY CORPRATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventor: Chen-Hsiu LIN