Abstract: A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles. A positioning device controls a position of the microdeposition head relative to the substrate. A controller (22) includes a positioning module that communicates with the positioning device and that generates position control signals for the positioning device. A nozzle firing module communicates with the microdeposition head (50) and selectively generates nozzle firing commands to define features of at least one layer of an electrical device, such as resistors, traces and capacitors on a printed circuit board, polymer light emitting diodes, and light panels.

Abstract: A microdeposition system (20) and method deposits precise amounts of fluid material onto a substrate. A microdeposition head (50) includes a plurality of spaced nozzles that fire droplets having a deposited width when deposited on the substrate. A positioning device moves the microdeposition head (50) relative to the substrate at a head speed. A controller (22) generates over-clocking signals at a rate that is substantially greater than the head speed divided by the droplet width to improve resolution. The controller (22) includes a positioning module that generates position control signals for the positioning device. The controller (22) includes a nozzle firing module (114) that generates nozzle firing commands based on the over-clocking rate to fire the nozzles to form droplets that define features on the substrate.

Abstract: A temperature controllable vacuum chuck includes a mounting bracket, a porous plate, a heating element, and a temperature sensor. The porous plate is mounted to the mounting bracket and is configured for securing a substrate to the vacuum chuck when air is suctioned out of the vacuum chuck. The heating element is attached to the bottom of the porous plate and uniformly heats the porous plate, thereby heating any substrate mounted on the vacuum chuck and enabling control over the cure rate of fluid materials deposited on the substrate. The temperature sensor measures the temperature of the porous plate so that it can be adjusted when desired with a user controllable temperature control component.