Abstract: An alpha-numeric display device having a modular structure for placement side-by-side in vertical and horizontal formats to present symbols, words and phrases. The device functions as a stand-alone peripheral, appearing to a controller, such as a microprocessing device, as a random access memory. In particular, the device is operative to receive a standarized 7-bit ASCII code and to translate it to a multiple segment display whereby it can be continuously presented. The device provides a small, relatively low-cost alphabet and number display with a built-in electronic interface to a microprocessing unit permitting word communication to be incorporated into compact equipment, such as hand-held terminals and portable display devices.

Abstract: An LED array with improved radiation intensity and distribution characteristics. A plurality of P-type regions are formed in an N-type substrate by growing an adherent dielectric layer onto the substrate, exposing a plurality of diffusion sites by selectively etching the dielectric layer and diffusing a dopant into the substrate at the diffusion sites until adjacent P-regions are joined by the process of lateral diffusion. The diffusion rate is controlled so that the interconnecting P-regions are extremely thin. These regions exhibit low photon absorption without the usual adverse surface effects formed in thin layers. The surface dielectric has a dielectric constant matched to that of the underlying LED material to optimize radiation transmission across their mutual boundary. The P-regions are geometrically arranged to provide improved radiation distribution at angles near the normal to the surface.

Abstract: A switch assembly having a plurality of movable elements for connection with underlying fixed contact elements carried by a base member, the movable insulative support sheet mounted on the base member. Each movable element is spaced by an electrically insulative sheet carried by the support sheet, and has a pair of opposed tines extending through the support sheet received in base member apertures. The movable elements may be dome shaped, partially cylindrical in shape, and span a plurality of the fixed contact elements.

Abstract: An ohmic contact for semiconductor devices, typically for contact to the P-type region of a GAsP Light Emitting Diode. The ohmic contact comprises a sequential deposition of a multi-layered structure comprising, respectively, aluminum, zinc and aluminum. The multi-layered structure is then heated at time and temperature conditions sufficient to fuse or alloy the metals and form a small region of P+ conductivity in the P-type semiconductor material.