Patents Assigned to LITTELFUSE FRANCE SAS
  • Patent number: 11303188
    Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: April 12, 2022
    Assignees: LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD., LITTELFUSE FRANCE SAS
    Inventors: Werner Johler, Philippe Di Fulvio
  • Publication number: 20190379259
    Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.
    Type: Application
    Filed: August 20, 2019
    Publication date: December 12, 2019
    Applicants: Littelfuse Electronics (Shanghai) Co., Ltd., Littelfuse France SAS
    Inventors: Werner Johler, Philippe Di Fulvio
  • Patent number: 10447117
    Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: October 15, 2019
    Assignees: Littelfuse Electronics (Shanghai) Co., Ltd., Littelfuse France SAS
    Inventors: Werner Johler, Philippe Di Fulvio
  • Patent number: 9548177
    Abstract: A smart fuse for circuit protection includes a first shaft and second shaft separated by a gap. A heater is located inside portions of the first and second shafts, and the heater is held in place within the shafts by a solder alloy that fills the gap. The shafts and solder alloy form an electrical signal path through the fuse. A spring is attached to the heater. The spring is stretched such that the spring exerts a force on the heater. The solder alloy holds the heater in place and resists the force exerted by the spring. In an activation condition of the fuse, the heater increases in temperature and melts the solder alloy. The melted solder alloy no longer resists the force exerted by the spring, and the spring pulls the heater through the second shaft until the gap is open, thereby severing the electrical connection through the fuse.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: January 17, 2017
    Assignee: LITTELFUSE FRANCE SAS
    Inventors: Dapeng Hou, Philippe Difulvio