Patents Assigned to Littelfuse, Inc.
  • Patent number: 9887057
    Abstract: A fuse includes first, second, and third terminals disposed on a substrate. Respective ends of one or more primary conductors of the fuse are connected to one of the first and the second terminals. The primary conductors have a first conductivity and are configured to open when a primary current between the first and the second terminals exceeds a first predetermined threshold. One or more secondary conductors have an end connected to the third terminal. The secondary conductors are configured to ignite when a secondary current through the secondary conductors exceeds a second predetermined threshold. When ignited, the secondary conductors open the primary conductors to thereby stop the primary current.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: February 6, 2018
    Assignee: Littelfuse, Inc.
    Inventors: Johnny Lam, Martyn A. Matthiesen, Matthew P. Galla, Jianhua Chen
  • Publication number: 20180012686
    Abstract: A flexible sheet of positive temperature coefficient (PTC) material formed of a polymer resin and a conductive filler, the sheet of PTC material having a thickness in a range of 10 ?m to 100 ?m. A method for forming the flexible sheet of positive temperature coefficient material may include preparing a PTC ink from a polymer resin, a conductive filler, and a solvent, applying the PTC ink to a substrate, pulling a blade over the PTC ink to create a uniformly thick layer of the PTC ink on the substrate, and allowing the PTC ink to dry so that the solvent evaporates and leaves a solid layer of PTC material on the substrate.
    Type: Application
    Filed: July 6, 2017
    Publication date: January 11, 2018
    Applicant: Littelfuse, Inc.
    Inventors: Boris Golubovic, Weiqing Guo, Jianhua Chen
  • Publication number: 20170373679
    Abstract: In one embodiment, an insulated gate bipolar transistor (IGBT) device may include an NMOS portion and a PNP portion, where the PNP portion is coupled to the NMOS portion. The PNP portion may include a base and a collector. The IGBT may further include a flyback clamp, where the flyback clamp is coupled between the base and the collector of the PNP portion.
    Type: Application
    Filed: July 5, 2017
    Publication date: December 28, 2017
    Applicant: Littelfuse, Inc.
    Inventor: Justin Michael Yerger
  • Publication number: 20170373142
    Abstract: A semiconductor device structure may include a substrate having a substrate base comprising a first dopant type; a semiconductor layer disposed on a surface of the substrate base, the semiconductor layer comprising a second dopant type and having an upper surface; and a semiconductor plug assembly comprising a semiconductor plug disposed within the semiconductor layer, the semiconductor plug extending from an upper surface of the semiconductor layer and having a depth at least equal to a thickness of the semiconductor layer, the semiconductor plug having a first boundary, the first boundary formed within the semiconductor layer, and having a second boundary, the second boundary formed within the semiconductor layer and disposed opposite the first boundary, wherein the first boundary and second boundary extend perpendicularly to the surface of the substrate base.
    Type: Application
    Filed: June 23, 2016
    Publication date: December 28, 2017
    Applicant: Littelfuse, Inc.
    Inventors: Ader Shen, Ting-Fung Chang, James Lu, Wayne Lin
  • Publication number: 20170358417
    Abstract: A circuit protection assembly (CPA) is disposed between a source of power and a circuit to be protected. The CPA comprises a mounting block having a bore extending therethrough and a recess cavity on a first surface of the mounting block. A post having a first end is disposed within the recess cavity and a body portion extends through the bore. The body portion configured to receive a terminal and the second end configured to receive a securing mechanism. A fuse having a centrally disposed aperture is configured to receive the body portion of the post and to receive the terminal for connection to a circuit to be protected. An insulator disposed on the terminal and disposed beneath the securing mechanism. The insulator configured to isolate the post from the terminal and the fuse while allowing the securing mechanism to apply an amount of torque.
    Type: Application
    Filed: August 28, 2017
    Publication date: December 14, 2017
    Applicant: Littelfuse, Inc.
    Inventors: Geoffrey Schwartz, Dana Scribner, Joe Thomas
  • Publication number: 20170358567
    Abstract: Transient suppression circuit arrangements are disclosed. In one implementation of a transient suppression circuit, at least one avalanche diode is coupled in series with a DIAC, a silicon diode for alternating current (SIDAC) device or SIDACtor.
    Type: Application
    Filed: May 3, 2017
    Publication date: December 14, 2017
    Applicant: Littelfuse, Inc.
    Inventors: James Allan Peters, Gary Mark Bentley
  • Patent number: 9831054
    Abstract: A thermal cut-off device includes a plastic base, two electrodes, a temperature sensing element, and a plastic cover that fits over the base. The temperature sensing element is curved downward, and may be a bimetal or a trimetal. When the device is subject to an over-temperature condition, the orientation of the curve flips such that the temperature sensing element is then curved upward. When the temperature sensing element is curved upward, it lifts an arm of one of the electrodes, which severs the electrical connection between the electrodes. In this manner the device shuts off during an over-temperature condition in order to protect the circuit in which the device is installed. To prevent corrosion of the temperature sensing element, a first moisture insulation layer is applied to the outer surface of the thermal cut-off device. The moisture insulation layer may be an epoxy adhesive or a UV/visible light-cured adhesive or light/heat cured adhesive.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: November 28, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Jianhua Chen, Weiqing Guo, Minh V. Ngo, Robert D Hilty, Arata Tanaka
  • Patent number: 9831055
    Abstract: An improved surface mount electrical fuse including a first fuse terminal; a second fuse terminal spaced apart from the first fuse terminal; and a fuse element formed from a conductive material, the fuse element having a support bridge for supporting the fuse element, the fuse element electrically connecting the first fuse terminal and the second fuse terminal.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: November 28, 2017
    Assignee: Littelfuse, Inc.
    Inventors: James J. Beckert, Gregory G. Stumpo, Andrew J. Saarnio
  • Patent number: 9825452
    Abstract: An apparatus may include a sensor housing, a light sensor disposed within the sensor housing, the light sensor arranged to generate a detection signal when light impinges on the light sensor, a sensor lens disposed at least partially outside the sensor housing, wherein a distal portion of the sensor lens extends a first distance above the sensor housing, the sensor lens being transparent, wherein light received from outside the sensor housing is transmitted to the light sensor; and a light emitter assembly disposed outside the sensor housing at a second distance above the housing less than the first distance.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: November 21, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Niels Holmgaard, Jakob Seedorff
  • Patent number: 9821762
    Abstract: A thick film polymer membrane switch can be positioned within a seat belt buckle. The switch can detect if the seat belt buckle is fastened or unfastened. In one approach, an apparatus includes a housing having a cavity, an insertion member moveable within the cavity, a connector positioned within the cavity, and a switch positioned within the cavity, wherein movement of the insertion member causes the connector to connect or disconnect from the switch. In some approaches, the switch includes a first conductive element formed adjacent a first layer of flexible film, and a second conductive element formed adjacent a second layer of flexible film, wherein the first and second layers of flexible film are separated by a gap.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: November 21, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Brian Johnson, Samuel Fuller
  • Patent number: 9824840
    Abstract: A circuit protection assembly (CPA) is disposed between a source of power and a circuit to be protected. The CPA comprises a mounting block having a bore extending therethrough and a recess cavity on a first surface of the mounting block. A post having a first end is disposed within the recess cavity and a body portion extends through the bore. The body portion configured to receive a terminal and the second end configured to receive a securing mechanism. A fuse having a centrally disposed aperture is configured to receive the body portion of the post and to receive the terminal for connection to a circuit to be protected. An insulator disposed on the terminal and disposed beneath the securing mechanism. The insulator configured to isolate the post from the terminal and the fuse while allowing the securing mechanism to apply an amount of torque.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: November 21, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Geoffrey Schwartz, Dana Scribner, Joe Thomas
  • Patent number: 9824842
    Abstract: A circuit protection device including a housing having a top section mounted to a bottom section, a first arc barrier extending from the bottom section, a second arc barrier extending from the top section, the top and bottom sections mounted together to define a cavity between the first arc barrier separated a distance from the second arc barrier, a first terminal and a second terminal secured to the bottom section, and a fuse element comprising a body of metallic material arranged in one of a plurality of geometric configurations mounted within the top section and the bottom section of the housing, extending through the first arc barrier and the second arc barrier and connected to the first and second terminals, wherein the first and second arc barriers resist arcing upon activation of the fuse and the fuse element melts upon occurrence of an overcurrent condition.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: November 21, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Redante Abad, Edwin Aberin, Ped Peterson Bruan
  • Patent number: 9797939
    Abstract: A device for monitoring a neutral grounding resistor (NGR), including first and second NGRs electrically connected in parallel, a rectifier circuit electrically connected in series with the second NGR and a voltage source and a logic resistor electrically connected in series with the second NGR. A logic circuit measures current passing through the logic resistor and determines the resistance of the first NGR based on the measured current and the resistance of the second NGR. As such, a failed-open or failed-short condition of the first NGR may be identified based at least in part on the determined resistance of the first NGR.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: October 24, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Michael P. Vangool, Geoffrey J. Baker
  • Patent number: 9799423
    Abstract: A cable is provided and includes a first conductor, a second conductor, and a PTC material layer. The PTC material layer is directly bonded to and electrically connects the first conductor and the second conductor.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: October 24, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Tao Guo, Wei Zheng, Jianyong Liu
  • Publication number: 20170271824
    Abstract: A circuit includes a connector having first and second mateable portions. Each portion includes at least two terminals configured to mechanically engage at least two terminals of the other portion. The two terminals within the first and second portions are arranged so that as the first and second portions are mated, a first terminal of the first portion and a first terminal of the second portions come into contact before respective second terminals of the first and second portions. The circuit also includes a polymeric positive temperature coefficient (PPTC) device with a first terminal in electrical communication with the first terminal of the first portion and a second terminal in electrical communication with the second terminal of the first portion. A power terminal is in electrical communication with the second terminal of the first portion and is configured to be connected to a power source.
    Type: Application
    Filed: March 21, 2016
    Publication date: September 21, 2017
    Applicant: Littelfuse, Inc.
    Inventors: Kedar V. Bhatawadekar, Mario G. Sepulveda, Jason Larson
  • Publication number: 20170263407
    Abstract: A fuse includes a fuse element and a fuse body. A portion of the fuse element is housed in a fuse body. The fuse element includes a first terminal and a second terminal disposed outside of the fuse body. The first terminal and the second terminal electrically connects the fuse element to a circuit to be protected and a power source. A first endbell and a second endbell is coupled to the fuse element. A predetermined amount of arc quenching material is disposed within the fuse body. The arc quenching material contacts at least a portion of the fuse element. The predetermined amount of the arc quenching material is less than a total volume size of the fuse tube. The arc quenching material is compacted. A remaining air gap in the fuse tube is filled with a liquid adhesive and cured to a solid state.
    Type: Application
    Filed: May 26, 2017
    Publication date: September 14, 2017
    Applicant: Littelfuse, Inc.
    Inventors: Michael Schlaak, Gregory Stumpo, Ken Venhaus, Derek Lasini
  • Patent number: 9761402
    Abstract: A fuse includes a fuse element and a fuse body. A portion of the fuse element is housed in a fuse body. The fuse element includes a first terminal and a second terminal disposed outside of the fuse body. The first terminal and the second terminal electrically connects the fuse element to a circuit to be protected and a power source. A first endbell and a second endbell is coupled to the fuse element. A predetermined amount of arc quenching material is disposed within the fuse body. The arc quenching material contacts at least a portion of the fuse element. The predetermined amount of the arc quenching material is less than a total volume size of the fuse tube. The arc quenching material is compacted. A remaining air gap in the fuse tube is filled with a liquid adhesive and cured to a solid state.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: September 12, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Michael Schlaak, Gregory Stumpo, Ken Venhaus, Derek Lasini
  • Publication number: 20170213682
    Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.
    Type: Application
    Filed: January 19, 2017
    Publication date: July 27, 2017
    Applicant: Littelfuse, Inc.
    Inventors: James Becker, Gregory Stumpo
  • Patent number: 9711424
    Abstract: A low thermal stress package for large area semiconductor dies. The package may include a substrate and at least one pedestal extending from the substrate, wherein the pedestal may have a mounting surface that is smaller than a mounting surface of a semiconductor die that is mounted to the pedestal. The bonded area between the die and the pedestal is therefore reduced relative to conventional semiconductor package substrates, as is the amount of thermal stress sustained by the die during thermal cycling.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: July 18, 2017
    Assignee: Littelfuse, Inc.
    Inventors: Richard J. Bono, Neil Solano
  • Patent number: 9673012
    Abstract: A convenient, cost-effective method for manufacturing low-current fuse elements. The method may include the steps of stamping a substrate out of a sheet of material and stamping at least one hole in the substrate. The method may further include the steps of bonding a layer of fuse material to a surface of the substrate with a portion of the fuse material covering the hole, stamping a fuse element out of the portion of fuse material covering the hole, and separating an individual fuse from the fuse material and the substrate. A low-current fuse can thereby be obtained using an easily performed stamping process.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: June 6, 2017
    Assignee: Littelfuse, Inc.
    Inventors: James J. Beckert, Gregory G. Stumpo, Stephen R. Shierry