Patents Assigned to Lockhead Missiles & Space Company, Inc.
  • Thermally stable electro-optic device and method
    Patent number: 5561733
    Abstract: Novel acceptor-donor-acceptor and donor-acceptor-donor compound for use in forming a thermally-stable electro-optic waveguide are disclosed. Also disclosed is a thermally stable waveguide material containing thermally stable acceptor-donor-acceptor or donor-acceptor-donor guest dipole compounds in a temperature-resistant polymer matrix. The waveguide has selected regions in which the net dipoles of the guest molecules are oriented, for electro-optic switching when an electric field is placed across these regions.
    Type: Grant
    Filed: May 8, 1995
    Date of Patent: October 1, 1996
    Assignee: Lockhead Missiles & Space Company, Inc.
    Inventors: Susan P. Ermer, Doris S. Y. Leung, Steven M. Lovejoy
  • Laser beam expanders
    Patent number: 5532880
    Abstract: A lens system (10) for a 5X laser beam expander includes lens elements (11, 12, 13, 14) which consist of crystalline and liquid optical materials. Several embodiments, using different materials for the lens elements (11, 12, 13, 14), provide diffraction-limited performance without refocussing over several wavelength ranges, the broadest being from 0.24 to 2.5 microns.
    Type: Grant
    Filed: July 1, 1994
    Date of Patent: July 2, 1996
    Assignee: Lockhead Missiles & Space Company, Inc.
    Inventor: Paul N. Robb
  • Graded-groove heat pipe
    Patent number: 5010951
    Abstract: A heat pipe and chemical etching technique is described for providing longitudinally extending capillary grooves of variable cross-sectional dimension on the interior surface of the heat pipe.
    Type: Grant
    Filed: August 3, 1989
    Date of Patent: April 30, 1991
    Assignee: Lockhead Missiles & Space Company, Inc.
    Inventors: Michael R. Kapolnek, Alexander R. Feild, Robert T. Hartle, Hillard R. Holmes
  • Semiconductor chip carrier and testing fixture
    Patent number: 3963315
    Abstract: An improved carrier for semiconductor chips is described. The carrier includes a base, a substrate including electrical conductors and a rectangular aperture for receiving the semiconductor chip mounted on the base. A transparent cover is installed over the chip and is retained there by a resilient metallic clip.
    Type: Grant
    Filed: April 7, 1975
    Date of Patent: June 15, 1976
    Assignee: Lockhead Missiles & Space Company, Inc.
    Inventor: Scott A. Bonis