Abstract: In accordance with the present invention, there are provided novel heterobifunctional monomers and uses for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.

Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

Abstract: In accordance with the present invention there are provided cycloaliphatic epoxy compounds and thermosetting resin compositions prepared therefrom. Inventive compounds are based on polycyclic hydrocarbon backbones, as illustrated by the following exemplary structure: wherein: each R is independently lower alkyl or halogen, n′″ is 1 up to about 8, and each x is independently 0, 1, or 2. Inventive compounds provide resins with desirable characteristics such as, for example, hydrophobicity, high Tg values, ionic purity, hydrolytic stability, and the like.

Abstract: In accordance with present invention there are provided novel epoxy derivatives of polycyclic compounds. Invention epoxies are particularly suited for incorporation into thermosetting resins. Resins comprising invention epoxies are hydrophobic and therefore less susceptible to popcorning upon cure or use in high temperature applications. The hydrophobicity also makes such resins less susceptible to hydrolysis upon exposure to moisture.

Abstract: In accordance with the present invention, there are provided novel heterobifunctional monomers and uses for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.