Patents Assigned to Logic Express System, Inc.
  • Patent number: 5903744
    Abstract: A hardware-based emulator is partitioned onto two boards. An emulation board has field-programmable gate array (FPGA) chips mounted on a top surface, and connection posts protruding through to the bottom surface. The I/O pins of the FPGA chips that carry emulated signals are connected to the connection posts but not directly to other FPGA chips on the emulation board. An interconnection board has a grid of wire-wrap posts. The tops of the wire wrap-posts mate with the connection posts when the emulation board is plugged in to the interconnection board. The wire-wrap posts extend through the interconnection board and out the bottom surface. Interconnection is made by wire-wrap wires wound around the wire-wrap posts. Thus interconnection between FPGA chips on the emulation board is made by wire-wrap on the interconnection board, while the logic gates are emulated in the FPGA chips on the separate emulation board.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: May 11, 1999
    Assignee: Logic Express System, Inc.
    Inventors: Allen Hui-Wan Tseng, Hung Van Tang, Vinh Coung Ta