Abstract: Potentially explosive mixtures which can form as a result of accidental contact between a concentrated aqueous solution of ammoniacal silver salt and a concentrated solution of a strong alkali are inhibited in an improved multi-part system for electroless deposition of silver on an activated surface by simultaneous admixture of the diluted parts thereupon. Accordingly, an improved method for inhibiting formation of explosive conditions and compounds in a mixture formed by contacting concentrated aqueous ammoniacal silver salt and a concentrated solution of alkali is provided, whereby an effective amount of an explosion inhibitor is provided either in combination with the ammoniacal silver salt, in which case sufficient extraneous ammonium ions are provided to stabilize the explosion inhibitor, or in the strong alkali, or a portion of the explosion inhibitor is provided in each of said ammoniacal silver salt and strong alkali.

Abstract: This invention relates to processes and compositions for the deposition of metallic copper on a catalytically activated surface by the controlled disproportionation of cuprous ions. Cupric tetraammino ions in aqueous solution are rapidly reduced to cuprous diammino ions and the latter are acted upon by the addition of an activator-modifier so as to bring about controlled disproportionation resulting in the deposition of metallic copper principally on the catalytically activated surface of a workpiece.