Abstract: This invention relates to a process for the application of conducting metallic, structured coatings on glass substrates, for example, for the manufacture of integrated circuits. The invention relies on placing a negative mask of the structure to be applied into the beam path of an excimer laser. After leaving the mask, the laser beam is directed onto a flat silica glass slice, the back side of which is in contact with a reductive copper bath. The process according to this invention requires exposure times no longer than seconds, after which the process proceeds autocatalytically. It can be stopped as soon as the desired coating thickness has been attained.

Abstract: A method and apparatus for creating through-connections in holes (5) in multi-layer printed circuit boards (2), in which the circuit board (2) is laid on a supporting frame (3) which leaves the area beneath the holes (5) free, and conductive paste (10) is injected by a dispensing apparatus (8, 9) into the holes (5) in the circuit board (2) with the formation of marginal overlaps (12), such that a protruding, outwardly spreading plug (11) of conductive paste is formed. In accordance with the method, a cartridge needle (8) of the dispensing apparatus (8, 9) is placed against the circuit board (2) at the location of each hole (5) that is to be provided with a through-connection, and solderable conductive paste (10) is dispensed into the hole (5), after which the cartridge needle (8) is removed.

Abstract: A method for patterned metallization of substrate surfaces, especially circuit boards, even three-dimensional ones, by using electromagnetic UV radiation, particularly from an excimer laser. In the method a primer layer is applied to the full substrate surface in the area of a metal layer that is subsequently applied; insulating channels then are made in the primer layer by complete removal of the primer in certain areas by the action of electromagnetic radiation in the UV range; and afterward the remaining patterned primer layer is provided with the metal layer to form conductor strips. The method makes it possible to create insulating channels with extremely sharp contours in the primer layer on the surface of even three-dimensional, electronic circuit media.

Abstract: A method for patterned metallization of the surface of substrates (1), particularly circuit boards, using electromagnetic radiation (5) in which an electrically nonconducting prime coat (2) is applied full-surface to the substrate (circuit board 1); an electrically nonconducting cover coat which is easily ablated by electromagnetic irradiation (5) in the ultraviolet range is applied full-surface to the prime coating (2), the cover coat (4) being applied in a thickness that is at least equal to the thickness of the metal layer that is to be applied; the cover coat is removed from partial areas by the action of electromagnetic irradiation (5) in the ultraviolet range to form patterns (6) with sharp and steep flanks (7) and expose the prime coat (2); and in the area of the exposed patterns (6) on the prime coat (2), a metal layer is applied, guided by the flanks (7), in a reducing bath.