Patents Assigned to LPKF Laser & Electronics AG
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Patent number: 12030079Abstract: A device for depositing liquid droplets onto a carrier includes a droplet generator and a holding device for the carrier, and a detector arranged to detect a signal for each liquid section or droplet, and a transport device for moving the holding device relative to the droplet generator and preferably a memory connected to the detector.Type: GrantFiled: March 10, 2022Date of Patent: July 9, 2024Assignee: LPKF Laser & Electronics AGInventors: Robin A. Krüger, Jan van Aalst, Moritz Woller
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Patent number: 11613803Abstract: Use of a laser-activatable component in a composition and/or use of a composition that includes the laser-activatable component, during laser transfer printing, characterized in that the laser-activatable component is activated by laser irradiation during use in such a way that the viscosity and/or the elasticity and/or the tack of the composition increase(s) due to an increase in temperature of the composition, wherein the laser-activatable component is a polymer made up of the groups comprising polyethylene glycol, polyvinylpyrrolidone, polyvinyl acetate, polyvinyl alcohol, polyacrylate, polyester, or copolymers of these polymers or blends.Type: GrantFiled: November 9, 2020Date of Patent: March 28, 2023Assignee: LPKF Laser & Electronics AGInventors: Robin Alexander Krüger, Malte Schulz-Ruhtenberg, Marc Hüske
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Patent number: 11446879Abstract: An apparatus for joining, in particular laser welding, two components, in particular plastics components, comprises—two workpiece receptacles (1, 3) for respectively holding the two components (2, 4) to be connected, —in each case one bearing element, preferably a bearing plate (7), for each of the workpiece receptacles (1, 3), —a clamping drive (SA) for at least one bearing element for feeding and bracing of the two components (2, 4) held in the workpiece receptacles (1, 3) during the joining process, —a controller (9) for the clamping drive (SA) and in particular a laser welding device (LS), and—a mechanically loose coupling between the clamping drive (SA) and bearing element (7) such that the two workpiece receptacles (1, 3) are tiltable towards one another during feeding and bracing. Also disclosed is a method for operating such a joining apparatus during a joining process of two components (2, 4) held in the workpiece receptacles (1, 3), in particular during a laser welding process.Type: GrantFiled: January 9, 2019Date of Patent: September 20, 2022Assignee: LPKF Laser & Electronics AGInventors: Michael Jonathan Schwalme, Nasir Fitil, Tobias Jaus, Manuel Sieben
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Patent number: 10300664Abstract: A system for welding two parts to be joined made of thermoplastic synthetic materials along a weld seam by a laser operating with a laser beam having a beam direction within an operating field by a control method with control data corresponding to the weld-seam course to be produced, including a beam dimension in the region around its focus causing the welding, which is smaller in the joint plane than the target width of the weld seam to be produced, and is dependent upon the angle of incidence of the laser beam on the joint plane and/or upon the position of the focus relative to the joint plane, is displaced in a first movement component in a principal forward-feed direction along the track of the weld-seam to be produced, in a second, oscillating movement component superimposed over the former to cover the weld-seam width transversely to the principal forward-feed direction with an oscillation amplitude value, and is adjusted with a control method in its oscillation amplitude width in inverse dependence upoType: GrantFiled: May 27, 2015Date of Patent: May 28, 2019Assignee: LPKF Laser & Electronics AGInventors: Benjamin Knoll, Michael Jonathan Schwalme, Manuel Sieben
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Publication number: 20170256422Abstract: A method for introducing at least one cutout, in particular in the form of an aperture, into a sheetlike workpiece having a thickness of less than 3 mm, involving detecting a laser beam onto the surface of the workpiece, selecting the exposure time of the laser beam to be extremely short so that only a modification of the workpiece concentrically around a beam axis of the laser beam occurs, such a modified region having defects resulting in a chain of blisters, and, as a result of the action of a corrosive medium, anisotropically removing material by successive etching in those regions of the workpiece that are formed by the defects and have previously been modified by the laser beam, resulting, along the cylindrical zone of action, in producing a cutout as an aperture in the workpiece.Type: ApplicationFiled: August 7, 2015Publication date: September 7, 2017Applicant: LPKF Laser & Electronics AGInventors: Norbert Ambrosius, Roman Ostholt
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Patent number: 9676927Abstract: This invention relates to products of aqueous and other chemical synthetic routes for encapsulation of a core material with an inorganic shell and finished compositions of a core-shell particulate material for application in thermoplastic, thermoset, and coatings resins prior to compounding or application or subsequent thermal processing steps. Disclosed is a composition of particles containing a shell of inorganic oxides or mixed-metal inorganic oxides and a core material of complex inorganic colored pigment, laser direct structuring additives, laser marking, or other beneficial metal oxides, metal compounds, or mixed-metal oxide materials, wherein the shell material is comprised of any single oxide or combination of oxides is taught. Preferred elements of composition for the shell are oxides and silicates of B, Ni, Zn, Al, Zr, Si, Sn, Bi, W, Mo, Cr, Mg, Mn, Ce, Ti, and Ba (or mixtures thereof).Type: GrantFiled: March 23, 2015Date of Patent: June 13, 2017Assignees: The Shepherd Color Company, LPKF Laser & Electronics AGInventors: Michael D. Musick, David Ziemnik, James P. White, Robin Alexander Krüger, Bernd Rösener, Malte Sebastian Fengler
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Patent number: 9021691Abstract: A method for introducing electrical insulations in a printed circuit board includes selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another. The end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions.Type: GrantFiled: March 23, 2011Date of Patent: May 5, 2015Assignee: LPKF Laser & Electronics AGInventor: Jan van Aalst
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Patent number: 8759710Abstract: A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.Type: GrantFiled: May 11, 2007Date of Patent: June 24, 2014Assignee: LPKF Laser & Electronics AGInventors: Frank Brunnecker, Alexander Hofmann
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Patent number: 8415583Abstract: The invention relates to a clamping device for clamping at least two components (6, 7) in a radiation-protected machine tool, particularly in a laser welding device (1), comprising—a receptacle (18) for supporting the first component (6), —a clamping head (16) for applying a force to the second component (7) in order to generate clamping pressure at the joint surface (8, 9) between the two components (6, 7), —an inner clamping jaw (11) located within the peripheral beam path (10) of the machine tool, the jaw having a clamping surface (12) for internally clamping the components (6, 7), and—narrow connecting struts (15) for connecting the inner clamping jaw (11) to the external clamping head (16), said connecting struts (15) bridging the passage gap (7) in the clamping head (16) allowing access for the beam path (10) of the machine tool to the components (6, 7).Type: GrantFiled: April 10, 2008Date of Patent: April 9, 2013Assignee: LPKF Laser & Electronics AGInventors: Frank Brunnecker, Holger Aldebert, Andreas Kraus
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Patent number: 8314362Abstract: A device for processing a workpiece using a plurality of parallel laser beams includes a focusing optical system displaceable in a direction of an axis of symmetry configured to focus each of the plurality of parallel laser beams onto a common focusing plane, and wherein the plurality of laser beams include a first and a second laser beam pair, each containing two laser beams equidistant from the axis of symmetry. The device further includes a reflector assembly having at least two reflectors each having a plurality of reflection surfaces displaceable relative to one another in a direction of the axis of symmetry.Type: GrantFiled: October 31, 2008Date of Patent: November 20, 2012Assignee: LPKF Laser & Electronics AGInventors: Matthias Kuester, Christian Krieg, Gennadij Kusnezow, Marc Hueske
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Patent number: 7559152Abstract: A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, includes placing the milling tool against a reference surface of the substrate, opening the tool holder to enable an axial mobility of the milling tool relative to the machining head, and moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.Type: GrantFiled: February 23, 2006Date of Patent: July 14, 2009Assignee: LPKF Laser & Electronics AGInventors: Stephan Wenke, Andreas Klocke, Boris Heuer
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Patent number: 7540934Abstract: In a method and an apparatus for irradiation welding of two thermoplastic components, a local temperature maximum, which circulates together with the laser beam and increases from cycle to cycle, and a correspondingly circulating, locally increased clamping pressure are generated in the area of joining.Type: GrantFiled: January 31, 2005Date of Patent: June 2, 2009Assignee: LPKF Laser & Electronics AGInventors: Alexander Hofmann, Stefan Hierl, Frank Brunnecker
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Patent number: 7510985Abstract: A method is described for the manufacture of structured flexible metallic patterns in which a metallic layer on a flexible substrate is structured using laser ablation. The flexible patterns manufactured in this fashion may be used as interposers (strap) for RFID tags or RFID antennas.Type: GrantFiled: October 26, 2005Date of Patent: March 31, 2009Assignee: LPKF Laser & Electronics AGInventors: Andreas Boenke, Dieter J. Meier
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Patent number: 7415927Abstract: A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.Type: GrantFiled: July 25, 2005Date of Patent: August 26, 2008Assignee: LPKF Laser & Electronics AGInventor: Stephan Wenke
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Publication number: 20070228106Abstract: A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.Type: ApplicationFiled: May 11, 2007Publication date: October 4, 2007Applicant: LPKF Laser & Electronics AGInventors: Frank BRUNNECKER, Alexander Hofmann
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Publication number: 20070204954Abstract: A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.Type: ApplicationFiled: May 11, 2007Publication date: September 6, 2007Applicant: LPKF Laser & Electronics AGInventors: Frank Brunnecker, Alexander Hofmann
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Publication number: 20060204652Abstract: A method for electrically connecting first and second circuit board conductors of a printed circuit board, wherein the first and second circuit board conductors being disposed in different planes of the circuit board and separated by an insulator layer, includes the step of placing a cover onto at least one of the first and second circuit board conductors and making a cutout through the cover, the insulator layer and the first and second circuit board conductors. In addition, an electrically conductive layer is applied under mechanical load onto the cover at least in the area of the cutout so that an electric connection is created along an inner wall surface of the cutout between the first and second circuit board conductors via the electrically conductive layer.Type: ApplicationFiled: March 9, 2006Publication date: September 14, 2006Applicant: LPKF Laser & Electronics AGInventor: Dieter Meier
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Publication number: 20060185144Abstract: A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, includes placing the milling tool against a reference surface of the substrate, opening the tool holder to enable an axial mobility of the milling tool relative to the machining head, and moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.Type: ApplicationFiled: February 23, 2006Publication date: August 24, 2006Applicant: LPKF Laser & Electronics AGInventors: Stephan Wenke, Andreas Klocke, Boris Heuer
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Patent number: 7060421Abstract: Conductive tracks disposed on an electrically non-conductive support material by depositing a metallized layer on metal nuclei produced by using electromagnetic radiation to break up electrically non-conductive metal compounds dispersed in the support material, and a method for producing them. The electrically non-conductive metal compounds are insoluble spinel-based inorganic oxides which are thermally stable and are stable in acidic or alkaline metallization baths, and which are higher oxides with a spinel structure, and which remain unchanged in non-irradiated areas. The spinel-based inorganic oxides used are heat resistant and remain stable after being subjected to soldering temperatures. The conductor tracks are reliably and easily produced and adhere strongly to the support.Type: GrantFiled: January 5, 2004Date of Patent: June 13, 2006Assignee: LPKF Laser & Electronics AGInventors: Gerhard Naundorf, Horst Wissbrock
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Publication number: 20060021528Abstract: A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.Type: ApplicationFiled: July 25, 2005Publication date: February 2, 2006Applicant: LPKF Laser & Electronics AGInventor: Stephan Wenke