Patents Assigned to LPKF Laser & Electronics AG
  • Patent number: 12030079
    Abstract: A device for depositing liquid droplets onto a carrier includes a droplet generator and a holding device for the carrier, and a detector arranged to detect a signal for each liquid section or droplet, and a transport device for moving the holding device relative to the droplet generator and preferably a memory connected to the detector.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: July 9, 2024
    Assignee: LPKF Laser & Electronics AG
    Inventors: Robin A. Krüger, Jan van Aalst, Moritz Woller
  • Patent number: 11613803
    Abstract: Use of a laser-activatable component in a composition and/or use of a composition that includes the laser-activatable component, during laser transfer printing, characterized in that the laser-activatable component is activated by laser irradiation during use in such a way that the viscosity and/or the elasticity and/or the tack of the composition increase(s) due to an increase in temperature of the composition, wherein the laser-activatable component is a polymer made up of the groups comprising polyethylene glycol, polyvinylpyrrolidone, polyvinyl acetate, polyvinyl alcohol, polyacrylate, polyester, or copolymers of these polymers or blends.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: March 28, 2023
    Assignee: LPKF Laser & Electronics AG
    Inventors: Robin Alexander Krüger, Malte Schulz-Ruhtenberg, Marc Hüske
  • Patent number: 11446879
    Abstract: An apparatus for joining, in particular laser welding, two components, in particular plastics components, comprises—two workpiece receptacles (1, 3) for respectively holding the two components (2, 4) to be connected, —in each case one bearing element, preferably a bearing plate (7), for each of the workpiece receptacles (1, 3), —a clamping drive (SA) for at least one bearing element for feeding and bracing of the two components (2, 4) held in the workpiece receptacles (1, 3) during the joining process, —a controller (9) for the clamping drive (SA) and in particular a laser welding device (LS), and—a mechanically loose coupling between the clamping drive (SA) and bearing element (7) such that the two workpiece receptacles (1, 3) are tiltable towards one another during feeding and bracing. Also disclosed is a method for operating such a joining apparatus during a joining process of two components (2, 4) held in the workpiece receptacles (1, 3), in particular during a laser welding process.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: September 20, 2022
    Assignee: LPKF Laser & Electronics AG
    Inventors: Michael Jonathan Schwalme, Nasir Fitil, Tobias Jaus, Manuel Sieben
  • Patent number: 10300664
    Abstract: A system for welding two parts to be joined made of thermoplastic synthetic materials along a weld seam by a laser operating with a laser beam having a beam direction within an operating field by a control method with control data corresponding to the weld-seam course to be produced, including a beam dimension in the region around its focus causing the welding, which is smaller in the joint plane than the target width of the weld seam to be produced, and is dependent upon the angle of incidence of the laser beam on the joint plane and/or upon the position of the focus relative to the joint plane, is displaced in a first movement component in a principal forward-feed direction along the track of the weld-seam to be produced, in a second, oscillating movement component superimposed over the former to cover the weld-seam width transversely to the principal forward-feed direction with an oscillation amplitude value, and is adjusted with a control method in its oscillation amplitude width in inverse dependence upo
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: May 28, 2019
    Assignee: LPKF Laser & Electronics AG
    Inventors: Benjamin Knoll, Michael Jonathan Schwalme, Manuel Sieben
  • Publication number: 20170256422
    Abstract: A method for introducing at least one cutout, in particular in the form of an aperture, into a sheetlike workpiece having a thickness of less than 3 mm, involving detecting a laser beam onto the surface of the workpiece, selecting the exposure time of the laser beam to be extremely short so that only a modification of the workpiece concentrically around a beam axis of the laser beam occurs, such a modified region having defects resulting in a chain of blisters, and, as a result of the action of a corrosive medium, anisotropically removing material by successive etching in those regions of the workpiece that are formed by the defects and have previously been modified by the laser beam, resulting, along the cylindrical zone of action, in producing a cutout as an aperture in the workpiece.
    Type: Application
    Filed: August 7, 2015
    Publication date: September 7, 2017
    Applicant: LPKF Laser & Electronics AG
    Inventors: Norbert Ambrosius, Roman Ostholt
  • Patent number: 9676927
    Abstract: This invention relates to products of aqueous and other chemical synthetic routes for encapsulation of a core material with an inorganic shell and finished compositions of a core-shell particulate material for application in thermoplastic, thermoset, and coatings resins prior to compounding or application or subsequent thermal processing steps. Disclosed is a composition of particles containing a shell of inorganic oxides or mixed-metal inorganic oxides and a core material of complex inorganic colored pigment, laser direct structuring additives, laser marking, or other beneficial metal oxides, metal compounds, or mixed-metal oxide materials, wherein the shell material is comprised of any single oxide or combination of oxides is taught. Preferred elements of composition for the shell are oxides and silicates of B, Ni, Zn, Al, Zr, Si, Sn, Bi, W, Mo, Cr, Mg, Mn, Ce, Ti, and Ba (or mixtures thereof).
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: June 13, 2017
    Assignees: The Shepherd Color Company, LPKF Laser & Electronics AG
    Inventors: Michael D. Musick, David Ziemnik, James P. White, Robin Alexander Krüger, Bernd Rösener, Malte Sebastian Fengler
  • Patent number: 9021691
    Abstract: A method for introducing electrical insulations in a printed circuit board includes selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another. The end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions.
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: May 5, 2015
    Assignee: LPKF Laser & Electronics AG
    Inventor: Jan van Aalst
  • Patent number: 8759710
    Abstract: A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: June 24, 2014
    Assignee: LPKF Laser & Electronics AG
    Inventors: Frank Brunnecker, Alexander Hofmann
  • Patent number: 8415583
    Abstract: The invention relates to a clamping device for clamping at least two components (6, 7) in a radiation-protected machine tool, particularly in a laser welding device (1), comprising—a receptacle (18) for supporting the first component (6), —a clamping head (16) for applying a force to the second component (7) in order to generate clamping pressure at the joint surface (8, 9) between the two components (6, 7), —an inner clamping jaw (11) located within the peripheral beam path (10) of the machine tool, the jaw having a clamping surface (12) for internally clamping the components (6, 7), and—narrow connecting struts (15) for connecting the inner clamping jaw (11) to the external clamping head (16), said connecting struts (15) bridging the passage gap (7) in the clamping head (16) allowing access for the beam path (10) of the machine tool to the components (6, 7).
    Type: Grant
    Filed: April 10, 2008
    Date of Patent: April 9, 2013
    Assignee: LPKF Laser & Electronics AG
    Inventors: Frank Brunnecker, Holger Aldebert, Andreas Kraus
  • Patent number: 8314362
    Abstract: A device for processing a workpiece using a plurality of parallel laser beams includes a focusing optical system displaceable in a direction of an axis of symmetry configured to focus each of the plurality of parallel laser beams onto a common focusing plane, and wherein the plurality of laser beams include a first and a second laser beam pair, each containing two laser beams equidistant from the axis of symmetry. The device further includes a reflector assembly having at least two reflectors each having a plurality of reflection surfaces displaceable relative to one another in a direction of the axis of symmetry.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: November 20, 2012
    Assignee: LPKF Laser & Electronics AG
    Inventors: Matthias Kuester, Christian Krieg, Gennadij Kusnezow, Marc Hueske
  • Patent number: 7559152
    Abstract: A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, includes placing the milling tool against a reference surface of the substrate, opening the tool holder to enable an axial mobility of the milling tool relative to the machining head, and moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.
    Type: Grant
    Filed: February 23, 2006
    Date of Patent: July 14, 2009
    Assignee: LPKF Laser & Electronics AG
    Inventors: Stephan Wenke, Andreas Klocke, Boris Heuer
  • Patent number: 7540934
    Abstract: In a method and an apparatus for irradiation welding of two thermoplastic components, a local temperature maximum, which circulates together with the laser beam and increases from cycle to cycle, and a correspondingly circulating, locally increased clamping pressure are generated in the area of joining.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: June 2, 2009
    Assignee: LPKF Laser & Electronics AG
    Inventors: Alexander Hofmann, Stefan Hierl, Frank Brunnecker
  • Patent number: 7510985
    Abstract: A method is described for the manufacture of structured flexible metallic patterns in which a metallic layer on a flexible substrate is structured using laser ablation. The flexible patterns manufactured in this fashion may be used as interposers (strap) for RFID tags or RFID antennas.
    Type: Grant
    Filed: October 26, 2005
    Date of Patent: March 31, 2009
    Assignee: LPKF Laser & Electronics AG
    Inventors: Andreas Boenke, Dieter J. Meier
  • Patent number: 7415927
    Abstract: A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.
    Type: Grant
    Filed: July 25, 2005
    Date of Patent: August 26, 2008
    Assignee: LPKF Laser & Electronics AG
    Inventor: Stephan Wenke
  • Publication number: 20070228106
    Abstract: A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.
    Type: Application
    Filed: May 11, 2007
    Publication date: October 4, 2007
    Applicant: LPKF Laser & Electronics AG
    Inventors: Frank BRUNNECKER, Alexander Hofmann
  • Publication number: 20070204954
    Abstract: A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.
    Type: Application
    Filed: May 11, 2007
    Publication date: September 6, 2007
    Applicant: LPKF Laser & Electronics AG
    Inventors: Frank Brunnecker, Alexander Hofmann
  • Publication number: 20060204652
    Abstract: A method for electrically connecting first and second circuit board conductors of a printed circuit board, wherein the first and second circuit board conductors being disposed in different planes of the circuit board and separated by an insulator layer, includes the step of placing a cover onto at least one of the first and second circuit board conductors and making a cutout through the cover, the insulator layer and the first and second circuit board conductors. In addition, an electrically conductive layer is applied under mechanical load onto the cover at least in the area of the cutout so that an electric connection is created along an inner wall surface of the cutout between the first and second circuit board conductors via the electrically conductive layer.
    Type: Application
    Filed: March 9, 2006
    Publication date: September 14, 2006
    Applicant: LPKF Laser & Electronics AG
    Inventor: Dieter Meier
  • Publication number: 20060185144
    Abstract: A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, includes placing the milling tool against a reference surface of the substrate, opening the tool holder to enable an axial mobility of the milling tool relative to the machining head, and moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.
    Type: Application
    Filed: February 23, 2006
    Publication date: August 24, 2006
    Applicant: LPKF Laser & Electronics AG
    Inventors: Stephan Wenke, Andreas Klocke, Boris Heuer
  • Patent number: 7060421
    Abstract: Conductive tracks disposed on an electrically non-conductive support material by depositing a metallized layer on metal nuclei produced by using electromagnetic radiation to break up electrically non-conductive metal compounds dispersed in the support material, and a method for producing them. The electrically non-conductive metal compounds are insoluble spinel-based inorganic oxides which are thermally stable and are stable in acidic or alkaline metallization baths, and which are higher oxides with a spinel structure, and which remain unchanged in non-irradiated areas. The spinel-based inorganic oxides used are heat resistant and remain stable after being subjected to soldering temperatures. The conductor tracks are reliably and easily produced and adhere strongly to the support.
    Type: Grant
    Filed: January 5, 2004
    Date of Patent: June 13, 2006
    Assignee: LPKF Laser & Electronics AG
    Inventors: Gerhard Naundorf, Horst Wissbrock
  • Publication number: 20060021528
    Abstract: A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.
    Type: Application
    Filed: July 25, 2005
    Publication date: February 2, 2006
    Applicant: LPKF Laser & Electronics AG
    Inventor: Stephan Wenke