Patents Assigned to LSI Lgoic Corporation
  • Apparatus and method of planarizing a semiconductor wafer that includes a first reflective substance and a second reflective substance
    Patent number: 6316276
    Abstract: A method of planarizing a semiconductor that includes (i) a substrate material, (ii) a first reflective substance positioned on the substrate material, (iii) an intermediate material positioned on the first reflective substance, wherein a channel is defined in a structure which includes the substrate, the first reflective substance, and the intermediate material, and (iv) a second reflective substance positioned on the intermediate material and in the channel is disclosed.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: November 13, 2001
    Assignee: LSI Lgoic Corporation
    Inventors: John W. Gregory, Derryl D. J. Allman