Abstract: A method and system for validating selected layers of an integrated circuit design. A rundeck is edited to include IC layers and device structures of interest that may require validation. In some embodiments the IC layer of interest may include only metal. A layout versus schematic (LVS) comparison is performed using the edited rundeck and an error report is generated.

Abstract: Via filling is enhanced by the techniques of 1) providing pillars immediately underneath semiconductor features, such as metal layer contacts (inter-connection points), and 2) polishing off excess via-filling material so that the via-filling plug is flush with the topmost insulating layer. The pillars are provided under every feature over which a via will be formed, so that an insulating layer surrounding the via will be thinner at the location of the feature. If necessary, polishing is continued to thin the insulating layer so that the plugs in initially selectively under-filled vias are made flush with the insulating layer. Method and apparatus are disclosed.