Abstract: A technique for mounting polishing pads to a platen in chemi-mechanical semiconductor wafer polishing apparatus is disclosed. A lower pad is mounted to the platen, and is trimmed to the size of the platen. An upper pad is mounted to the lower pad, and is sized so that an extreme outer edge portion of the upper pad extends beyond the trimmed outer edge of the lower pad. The outer edge portion of the upper pad is deformed downwardly, towards the lower pad. In this manner, polishing slurry is diverted from the pad-to-pad interface. Additionally, an integral annular lip can be formed on the front face of the upper pad, creating a reservoir for slurry to be retained on the face of the upper pad for enhancing residence time of the polishing slurry prior to the slurry washing over the face of the upper pad.

Abstract: A display system displays a cursor on a monitor using parallel pixels of video data. A hardware cursor processor receives a sequence of clock signals, cursor data, parallel video data arranged in P logical pixels per clock signal, and cursor position data. The hardware cursor processor provides composite video data representative of the cursor data and the video data to a memory. The composite video data is arranged in P logical pixels per clock signal. The hardware cursor processor arranges the cursor data within the P logical pixels per clock signal in response to the cursor position data. The cursor position data includes a position signal HPOS indicative of the horizontal position of the cursor on the screen and includes a preset signal HPRE indicative of the horizontal offset of the cursor. The cursor data is arranged within the P logical pixels of the composite video data to begin at the logical pixel equal to [(HPOS-HPRE) modulus P].