Patents Assigned to LumaChip, Inc.
  • Bare die semiconductor device configured for lamination
    Patent number: 8183582
    Abstract: A bare die semiconductor device, e.g., a bare die LED, includes a substrate having a bottom face and a bottom die electrode. There is also a top face having a top face edge, a top face area, a top face periphery and a top die electrode. A semiconductor material provides a p-n semiconductor junction between the top and bottom faces. The top die electrode inhibits an external top planar electrode from contact with the top face edges. Such bare die LEDs can be incorporated into a light sheet that has a transparent first substrate having a planar top electrode and a second substrate having a bottom substrate electrode. An adhesive secures the second substrate to the first substrate. Bare die LEDs are disposed in the adhesive with their top die electrodes contacting the top planar electrode and their bottom die electrodes contacting the bottom substrate electrode.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: May 22, 2012
    Assignee: Lumachip, Inc.
    Inventor: John J. Daniels
  • Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
    Patent number: 8129730
    Abstract: An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: March 6, 2012
    Assignee: Lumachip, Inc.
    Inventor: John J. Daniels
  • Solid state light sheet and encapsulated bare die semiconductor circuits with electrical insulator
    Patent number: 7952107
    Abstract: An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: May 31, 2011
    Assignee: Lumachip, Inc.
    Inventors: John James Daniels, Gregory Victor Nelson
  • Roll-to-roll fabricated encapsulated semiconductor circuit devices
    Patent number: 7863760
    Abstract: An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements having a first conductor and a second conductor.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: January 4, 2011
    Assignee: LumaChip, Inc.
    Inventors: John J. Daniels, Gregory Victor Nelson