Abstract: The invention relates to a frame structure for light emitting diodes comprises plastic stand having a containing room with a conical opening and at least two metal frames being not connected, relatively arranged in the containing room of the plastic stand and one of the metal frames having a concave chip bearing stand for bearing light emitting diodes wherein the conical opening of the plastic stand is greater than the concave chip bearing stand and the concave chip bearing stand has a bottom edge revealed at a bottom of the plastic stand; the area of the concave chip bearing stand is greater than 40% of the area of the conical opening of the plastic stand to increase the cooling area of the metal frames for the light-emitting diodes with the different wattage sharing the same specification frame structure to reduce the cost of metal frames molding.

Abstract: The invention relates to a frame structure for light emitting diodes comprises plastic stand having a containing room with a conical opening and at least two metal frames being not connected, relatively arranged in the containing room of the plastic stand and one of the metal frames having a concave chip bearing stand for bearing light emitting diodes wherein the conical opening of the plastic stand is greater than the concave chip bearing stand and the concave chip bearing stand has a bottom edge revealed at a bottom of the plastic stand; the area of the concave chip bearing stand is greater than 40% of the area of the conical opening of the plastic stand to increase the cooling area of the metal frames for the light-emitting diodes with the different wattage sharing the same specification frame structure to reduce the cost of metal frames molding.

Abstract: A LED-packaging arrangement with uniform light and wide angle includes: a substrate, a reflector cup molded upon the substrate, a light-emitting diode mounted on the substrate and located inside the reflector cup, an encapsulation body molded inside the reflector cup and covering the light-emitting diode, and a wide-angle lens molded directly on the top surface of the reflector cup and the encapsulation body to form a wide-angle light distribution and an uniform light emitting. Whereby, the present invention substantially reduces an optical attenuation to overcome the optical attenuation problem of the prior art, and avoids an alignment and combination problems of the conventional secondary packaging.

Abstract: An SMT encapsulation body of a light-emitting diode with a wide-angle illumination light shape, comprising: a) a substrate; b) an LED die mounted on the substrate by use of SMT; and c) an encapsulation body positioned around the LED die in the shape of a double dome at the top thereof with the center at a lower position such that the illumination light shape of the light-emitting diode becomes to be a wide-angle and elongated body. The encapsulation body may be formed either in the shape of a batwing or in the shape of a double batwing symmetrically positioned in a cross way. In this way, the light-emitting diode achieves a wide-angle illumination light shape fulfilling the requirements of a certain purpose without the use of the double optical effect of the lens. Meanwhile, the drawbacks of the conventional structure are resolved. Moreover, an increased efficiency in using the light source is ensured.

Abstract: An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and via connection wires electrically coupled to the first and second connection blocks; a positioning/packaging body, and a transparent packaging body. Alternatively, a third connection block is provided with an enclosure groove at the bottom thereof. In this case, the electrical connection originally to the first connection block via the connection wire is changed to the third connection block. The first and second connection blocks are enclosed by the lower part of the positioning/packaging body in position such that the bottom surfaces of the first and second connection blocks are exposed. The upper part of the positioning/packaging body encloses the light-emitting chip so as to create a reflection cap.