Abstract: An optical subassembly may include a device mounting substrate on which an optical device is mounted, a relay substrate including a first conductor pattern transmitting a electrical signal to the optical device, a pedestal including a third surface on which the relay substrate is placed and a fourth surface on which the device mounting substrate is placed and a spacer interposed between the third surface and the relay substrate to electrically connect the relay substrate and the pedestal. In an optical subassembly, the first lead terminal may include a small-diameter part and a large-diameter part provided at an end of the small-diameter part and having a larger diameter than that of the small-diameter part, and at least part of the large-diameter part may be exposed from the dielectric on a first surface side and the first lead terminal and the first conductor pattern may be connected by brazing and soldering.

Abstract: Provided is an optical transmission module which can generate PAM4 optical modulation signals without converting a plurality of binary electric signals to a multi-level electric signal. An optical transmission module (200) comprising: a light source (60) for emitting continuous waveform (CW) light; optical modulators (51,52,53) arranged in series with a path of the CW light configured to modulate the CW light by switching relatively large absorption and relatively small absorption of the optical modulators in response to a modulation signal applied to the respective optical modulators; and an arithmetic logic circuit (100) configured to receive a plurality of binary electrical signals, and then to perform logic operation on the plurality of binary electrical signals for generating a new plurality of binary electrical signals, wherein each of the new plurality of binary electrical signals is applied to the respective optical modulators as the modulation signal.

Abstract: An optical subassembly may have an optical waveguide for transmitting an optical signal, a lens element with a lens and a mirror integrated, a supporting element to which the optical waveguide and the lens element are attached, an optical element for converting the optical signal and an electric signal from one to another at least, and a substrate to which the optical element and the supporting element are attached.

Abstract: An optical multiplexer/demultiplexer may include some beam splitters on the first surface, a first reflector on the first surface and between the beam splitters, and a second reflector on the second surface. Light propagates between the first surface and the second surface. The light transmission body has some first input/output sections on the first surface for inputting or outputting the respective signal beams. The light transmission body has a second input/output section on the second surface for inputting or outputting the multiplexed signal beam. Each of the beam splitters is placed at a corresponding one of the first input/output sections to pass a corresponding one of the signal beams. The first reflector stays away from any one of the first input/output sections.

Abstract: Provided is an optical semiconductor device including a semiconductor substrate; a first semiconductor multilayer that is stacked on a first surface side of the semiconductor substrate, has a mesa structure extending along a light emitting direction, and emits light from an exit end surface; an electrode pad portion for wire bonding which is electrically connected to the upper surface of the mesa structure of the first semiconductor multilayer, is disposed on one side of the mesa structure, and is electrically connected to outside; and an electrode pad peripheral portion including a first rising surface which is in contact with the outer edge of the electrode pad portion on the exit end surface side and rises along the stacking direction from the electrode pad portion, in which a lower surface of the electrode pad portion is higher than the upper surface of the mesa structure of the first semiconductor multilayer.

Abstract: To provide an optical subassembly, an optical module, and an optical transmission equipment including simpler components. A first component with an optical semiconductor device mounted thereon that dissipates heat generated by the optical semiconductor device to outside, a second component in contact with the first component to form a box type housing, and a receptacle terminal that optically joined to the optical semiconductor device are provided, wherein the second component includes a window structure for transmitting light transmitted between the optical semiconductor device and the receptacle terminal, and the receptacle terminal is fused and fixed to the outside of the window structure.

Abstract: An optical module includes a conductor plate including a first through hole, a signal lead terminal fixed to the first through hole, and a wiring circuit board. The wiring circuit board includes a signal strip conductor member and a land on a first surface and a ground conductor layer and a second through hole on a second surface, the land surrounds the second through hole and is in contact with the signal strip conductor member, the signal lead terminal and the land are physically connected to each other through a solder and thus the signal lead terminal and the signal strip conductor member are electrically connected to each other, and at least a part of the land spreads outwardly, in a plan view, from not only a portion in contact with the signal strip conductor member but also an outer edge of the first through hole.

Abstract: Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance Hi between the pair of strip conductors and the ground conductor layer is twice or more a distance H2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.

Abstract: In the arrayed semiconductor optical device, a plurality of semiconductor optical devices including a first semiconductor optical device and a second semiconductor optical device are monolithically integrated on a semiconductor substrate, each of the semiconductor optical devices includes a first semiconductor layer having a multiple quantum well layer and a grating layer disposed on an upper side of the first semiconductor layer, a layer thickness of the first semiconductor layer of the first semiconductor optical device is thinner than a layer thickness of the first semiconductor layer of the second semiconductor optical device, and a height of the grating layer of the first semiconductor optical device is lower than a height of the grating layer of the second semiconductor optical device corresponding to difference in the layer thickness of the first semiconductor layer.

Abstract: There are provided an optical receiver module with an improvement in high frequency characteristic and reduction in size. The optical receiver module includes a substrate, an IC provided with two or more IC terminals, a light receiving element disposed in front of the IC, provided with two or more PD terminals and having a light receiving window, and a first optical component disposed in front of the IC provided with two bridge footing sections, and a lens main body section located between upper portions of the two bridge footing sections, the lens main body section is provided with a lens and a mirror, and a distance L1 between a position A of the lens and a position B of the light receiving window is longer than a distance L2 between the position B and a position C of an end part of the two bridge footing sections.

Abstract: The first transmission line has a width perpendicular to a transmission direction. The first electrode has a width not exceeding the width. The first electrode is opposed to the first transmission line. The ground layer has a positional relationship with each portion of the first transmission line. The ground layer is next to the first transmission line on at least one side consisting of a first side along a thickness direction of the mounting substrate, and a second side and a third side with the first transmission line interposed therebetween. The first transmission line is bonded to the first electrode and has the width equivalently, at least, at a portion of the first transmission line. The portion equivalently has the positional relationship with the ground layer. The portion is next to the ground layer in an equivalent shape along the transmission direction.

Abstract: The present invention provides a printed circuit board comprising: a dielectric layer (130); N pairs of differential signal vias (2) which penetrate through the dielectric layer wherein N is an integer more than one; N pairs of first strip conductors (101, 102) disposed on a first surface of the dielectric layer; a first ground conductor layer (103) disposed in the dielectric layer forming N first differential transmission lines (100) with the N pairs of first strip conductors and the dielectric layer; N pairs of second strip conductors (111,112) disposed on a second surface of the dielectric layer; a second ground conductor layer (113) disposed in the dielectric layer forming N of second differential transmission lines (110) with the N pairs of second strip conductors and the dielectric layer.

Abstract: Provided are an optical transceiver, an optical transmitter IC, and an optical receiver IC, which can be applied to both a case of coding an optical signal and a case of decoding an optical signal, and can suppress an influence of waveform degradation with an inexpensive circuit. The optical transceiver includes an optical transmitter, an optical receiver, and at least any one of: a first delay circuit included in the optical transmitter and configured to delay an input first multi-level digital signal by a delay time corresponding to an amplitude level of the first multi-level digital signal; and a second delay circuit included in the optical receiver and configured to delay an input second multi-level digital signal by a delay time corresponding to an amplitude level of the second multi-level digital signal.

Abstract: There is provided an optical module, including a first optical subassembly, a second optical subassembly, a first flexible printed circuit board, and a second flexible printed circuit board. The first/second optical subassembly includes a first/second normal phase lead terminal and a first/second reverse phase lead terminal, arranged in a positive direction of a first orientation. The first/second flexible printed circuit board includes a first/second normal phase strip conductor, a first/second reverse phase strip conductor, and a ground conductor layer. The back surface of the first/second flexible printed circuit board faces the end surface of the first/second optical subassembly. The first/second normal phase strip conductor extends in a positive/negative direction of a second orientation.

Abstract: There is provided an optical module, including a first optical subassembly, a second optical subassembly, a first flexible printed circuit board, and a second flexible printed circuit board. The first/second optical subassembly includes a first/second normal phase lead terminal and a first/second reverse phase lead terminal, arranged in a positive direction of a first orientation. The first/second flexible printed circuit board includes a first/second normal phase strip conductor, a first/second reverse phase strip conductor, and a ground conductor layer. The back surface of the first/second flexible printed circuit board faces the end surface of the first/second optical subassembly. The first/second normal phase strip conductor extends in a positive/negative direction of a second orientation.

Abstract: The optical subassembly includes a photodetector including element terminal groups for light-receiving elements, and an electric signal controller including IC terminal groups, wherein any one of the element terminal group and the IC terminal group has a two-terminal configuration, and the other one has a three-terminal configuration, wherein, in a case where terminal groups at both ends where center positions thereof are disposed on the inner side together and have the two-terminal configuration, the first connection terminals are disposed on the outer side than a second connection terminals in the two-terminal configuration, and in a case where terminal groups at both ends where center positions thereof are on the outer side together and have the two-terminal configuration, a first connection terminal in the two-terminal configuration is disposed on the inner side than the second connection terminal.