Abstract: This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.

Abstract: A light source is positioned to direct light downward from the cover of a conentional analog or electro-optical watch, indicator gauge, a meter panel directional gauge or ornamentation display of an image, logo or design or other similar articles. These articles are illuminated by the source for viewing in low light or in the dark by an illumination switch to activate said element. The light source is preferably an LED and it is small enough so that when it is off, it is virtually invisible.

Abstract: The customized clear, free from impediment, obstruction, or hindrance, or the translucent or transparent transmission of light is permitted to shine through an injected or poured pliable plastic which could be PVC, formulated to emit the maximum even dispersion of LED (light emitting diodes), illumination. The single or multiple LEDs are fitted into a cavity usually in the back of the plastic unit in order for the emission of light to pass through the unit. This light emitting unit is usually molded for application onto wearable apparel, accessories or decorative items and can be molded into varying shapes, colors, designs or logos with impressions within or on the surface in flat, two dimensional or three dimensional properties for illumination and exploitation of said unit.