Patents Assigned to LumiShield Technologies Incorporated
  • Methods and compositions for electrochemical deposition of metal rich layers in aqueous solutions
    Patent number: 11111591
    Abstract: Methods and compositions for electrodepositing mixed metal reactive metal layers by combining reactive metal complexes with electron withdrawing agents are provided. Modifying the ratio of one reactive metal complex to the other and varying the current density can be used to vary the morphology the metal layer on the substrate.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: September 7, 2021
    Assignee: LUMISHIELD TECHNOLOGIES INCORPORATED
    Inventors: Hunaid B. Nulwala, John D. Watkins
  • Electrochemical Deposition of Elements in Aqueous Media
    Publication number: 20190256994
    Abstract: The disclosure relates to a method for the electrodeposition of at least one metal onto a surface of a conductive substrate. In some embodiments, the electrodeposition is conducted at a temperature from about 10° C. to about 70° C., about 0.5 atm to about 5 atm, in an atmosphere comprising oxygen. In some embodiments, the method comprises electrodepositing the at least one metal via electrochemical reduction of a metal complex dissolved in a substantially aqueous medium.
    Type: Application
    Filed: February 16, 2016
    Publication date: August 22, 2019
    Applicant: LumiShield Technologies Incorporated
    Inventors: Hunaid B. NULWALA, John D. WATKINS, Xu ZHOU