Abstract: An LED module, selectively comprising at least zero, one, or a plurality of LEDs from Group B and/or Group G and/or Group R and at least one or more LEDs from Group P. The concentration of phosphors/phosphor mixtures of the LEDs in Group P is selected such that the photometric efficiency (lm/W) thereof is at or near the maximum as a function of the CIE x-coordinates.

Abstract: An LED module, selectively comprising at least zero, one, or a plurality of LEDs from Group B and/or Group G and/or Group R and at least one or more LEDs from Group P. The concentration of phosphors/phosphor mixtures of the LEDs in Group P is selected such that the photometric efficiency (lm/W) thereof is at or near the maximum as a function of the CIE x-coordinates.

Abstract: An LED module, selectively comprising at least zero, one, or a plurality of LEDs from Group B and/or Group G and/or Group R and at least one or more LEDs from Group P. The concentration of phosphors/phosphor mixtures of the LEDs in Group P is selected such that the photometric efficiency (lm/W) thereof is at or near the maximum as a function of the CIE x-coordinates.

Abstract: SiO2 layers are used as adhesion layers in the case of optoelectronic components. Durable adhesions can be produced with silicone rubbers. These materials normally have only an insufficient adhesive strength on materials as frequently used for optoelectronic components, such as LED modules. This then leads in further consequence to a clear reduction of the operating life of the manufactured components. These restrictions are avoided effectively by the use of the adhesion layers, endurance upon operation in damp surroundings and upon temperature change loading is substantially improved.

Abstract: An LED module comprises at least one LED chip emitting monochromatic light having a first spectrum, a platform on which the LED chip is mounted, a reflecting wall that is separate from or integrated into the platform and surrounds the LED chip on all sides, and a dispensed layer applied above the LED chip. The dispensed layer extends in a dome-shaped manner beyond the reflecting wall such that the following equation is satisfied: 0.1*b?h?0.5*b where h is the height of the dome-shaped dispensed layer, measured from the topmost point of the reflecting wall to the apex of the dome, and b is the diameter of the depression formed by the reflecting wall, measured as the distance from the central axis of the wall.

Abstract: An LED module comprises at least one LED chip (4) emitting monochromatic light having a first spectrum, a platform (2) on which the LED chip is mounted, a reflecting wall (9) that is separate from or integrated into the platform and surrounds the LED chip on all sides, and a dispensed layer (11) applied above the LED chip. The dispensed layer extends in a dome-shaped manner beyond the reflecting wall such that the following equation is satisfied: 0.1*b?h?0.5*b, where h is the height of the dome-shaped dispensed layer, measured from the topmost point of the reflecting wall to the apex of the dome, and b is the diameter of the depression formed by the reflecting wall, measured as the distance from the central axis of the wall.

Abstract: An LED module, selectively comprising at least zero, one, or a plurality of LEDs from Group B and/or Group G and/or Group R and at least one or more LEDs from Group P. The concentration of phosphors/phosphor mixtures of the LEDs in Group P is selected such that the photometric efficiency (lm/W) thereof is at or near the maximum as a function of the CIE x-coordinates.

Abstract: SiO2 layers are used as adhesion layers in the case of optoelectronic components. Durable adhesions can be produced with silicone rubbers. These materials normally have only an insufficient adhesive strength on materials as frequently used for optoelectronic components, such as LED modules. This then leads in further consequence to a clear reduction of the operating life of the manufactured components. These restrictions are avoided effectively by the use of the adhesion layers, endurance upon operation in damp surroundings and upon temperature change loading is substantially improved.