Abstract: A light emitting diode (LED) chip package is provided. The LED chip package comprises a carrier, a first LED chip, a second LED chip and an encapsulant. The first LED chip is disposed on and electrically connected to the carrier, wherein the first LED chip is adapted for emitting a first light. The second LED chip is disposed on and electrically connected to the carrier, wherein the second LED chip is adapted for emitting a second light. The encapsulant has a doped phosphor, and encapsulates the first LED chip and the second LED chip, wherein the first light is adapted for exciting the doped phosphor to emit a third light.

Abstract: A light emitting diode lamp including a housing having at least one hole, a light bar, a heat dissipation device, and a shade is provided. The light bar is disposed inside the housing, and has a circuit substrate and a plurality of LEDs disposed thereon. The heat dissipation device includes a heat conducting pipe and a heat sink, where the heat conducting pipe is connected to the circuit substrate, and extends to the outside of the housing through the hole. The heat sink is disposed on the portion of the heat conducting pipe exposed outside the housing. The shade is disposed on the housing, and shades the heat dissipation device.

Abstract: A monitoring apparatus including a circuit board, a light emitting diode array, and a sensor is provided. The light emitting diode array and the sensor are disposed on the circuit board and are electrically connected with the circuit board.

Abstract: An LED lamp including a lamp housing, an LED light source, a heat sink and a control circuit. The lamp housing has an accommodating space, a plurality of air inlets and a plurality of air outlets, wherein the accommodating space joins an environment through the air inlets and the air outlets. The LED light source and the heat sink are disposed in the accommodating space and the heat sink is connected with the LED light source. The heat sink includes a pedestal and a plurality of heat dissipation fins connected to the pedestal. An air convection channel is located between any two adjacent heat dissipation fins. Air from the environment flows into the accommodating space, passes through the air convection channel, and leaves the accommodating space via the air outlets sequentially. The control circuit is disposed in the accommodating space and connected to the LED light source.