Abstract: An AC LED module having surge protection function includes: an insulation seat, formed with a first surface and a second surface, wherein a concave area is formed on the first surface, and an opening is formed at a substantially central portion of the concave area; an annular fasten member, fastened in the concave area of the insulation seat, and formed with at least one buckle structure for being combined with a reflection cup; a circuit board, installed with a LED light source, wherein the circuit board is fastened on the second surface of the insulation seat, and the LED light source is aligned with the opening; and a surge absorbing member, disposed at the exterior of the insulation seat and electrically coupled to an AC power input port of the circuit board, thereby preventing the circuit board from being damaged by an AC surge.

Abstract: A compact LED module includes: a circuit substrate, formed with an opening, a pair of combination holes and at least one through via area formed with a plurality of through vias; a reflection cup, formed with a light inlet, a light outlet and a pair of combination posts, wherein the pair of combination posts are combined with the pair of combination holes for allowing the reflection cup to be fastened on a first surface of the circuit substrate, and the light inlet is aligned with the opening; and a LED unit, installed with a LED light source and formed with at least one soldering area, wherein each of the soldering areas is connected to each of the through via areas by utilizing solder, thereby allowing the LED unit to be fastened on a second surface of the circuit substrate, and the LED light source is aligned with the opening.

Abstract: A 3D-structured pattern reading system, including: an object having a front face formed with a 3D-structured pattern for representing predetermined data; and a reading device including a camera unit and a liquid lens unit, wherein the liquid lens unit has a variable focal length controlled by the camera unit to scan the 3D-structured pattern to derive the predetermined data with the object being placed at a distance not exceeding a maximum limit of the variable focal length from the liquid lens unit.

Abstract: A DC LED module having bridge rectifying and filtering function includes: an insulation seat, formed with a first surface and a second surface, wherein a concave area is formed on the first surface, and an opening and at least one buckle slot are formed at a substantially central portion of the concave area; a reflection cup, formed with at least one buckle structure for being buckled with the at least one buckle slot of the insulation seat; a circuit board, installed with an LED light source, wherein the circuit board is fastened on the second surface of the insulation seat, and the LED light source is aligned with the opening; and a bridge rectifying and filtering member, disposed at the exterior of the insulation seat and electrically coupled to a power input port of the circuit board for providing a DC voltage to the circuit board.

Abstract: A light emitting module includes a base unit, a substrate unit, a light emitting unit and a driving unit. The base unit includes a base body having a horizontal carrying surface and at least one inclined carrying surface. The inclined carrying surface is inclined by a predetermined angle relative to the horizontal carrying surface. The substrate unit includes a bendable substrate disposed on the base body. The bendable substrate has a horizontal portion disposed on the horizontal carrying surface, at least one inclined portion disposed on the inclined carrying surface, and at least one bending portion disposed between the horizontal and the inclined portions. The inclined portion is inclined by a predetermined angle relative to the horizontal portion. The light emitting unit includes at least one light emitting group disposed on the horizontal portion. The driving unit includes a plurality of electronic components disposed on the inclined portion.

Abstract: A lighting device capable of changing light patterns, includes: (a) a heat dissipating substrate; (b) a light source, located on the heat dissipating substrate; (c) a first dielectric liquid, covering the light source and having a first dielectric constant; (d) a second dielectric liquid, covering the first dielectric liquid and having a second dielectric constant; and (e) an enclosing wall, located on the heat dissipating substrate for containing the first dielectric liquid and the second dielectric liquid.

Abstract: A LED package structure includes a substrate unit, a light-emitting unit, a support unit, a lens unit, an input unit and a control unit. The light-emitting unit includes at least one light-emitting element electrically connected to the substrate unit. The support unit includes a support element disposed on the substrate unit and surrounding the light-emitting element. The lens unit includes an electrically-controlled zoom lens disposed above the light-emitting element and retained by the support element. The input unit includes a signal input module for providing a predetermined voltage signal. The control unit includes a voltage controlling module electrically connected between the electrically-controlled zoom lens and the signal input module.

Abstract: An LED lighting assembly integrated with dielectric liquid lens, including: a heat dissipation substrate; an LED chip, located on the heat dissipation substrate; a transparent material, covering the heat dissipation substrate and the LED chip and having a curved surface; a transparent liquid, located above the transparent material; a transparent layer, located above the transparent liquid; a first dielectric liquid, located above the transparent layer; a second dielectric liquid, located above the first dielectric liquid and having a curved surface, wherein the second dielectric liquid has a second dielectric constant smaller than a first dielectric constant of the first dielectric liquid; a transparent electrode layer, located above the second dielectric liquid for applying a control voltage to generate a dielectric force on the second dielectric liquid; and an enclosing body.

Abstract: A LED package structure includes a substrate unit, a light-emitting unit, a support unit, a lens unit, an input unit and a control unit. The light-emitting unit includes at least one light-emitting element electrically connected to the substrate unit. The support unit includes a support element disposed on the substrate unit and surrounding the light-emitting element. The lens unit includes an electrically-controlled zoom lens disposed above the light-emitting element and retained by the support element. The input unit includes a signal input module for providing a predetermined voltage signal. The control unit includes a voltage controlling module electrically connected between the electrically-controlled zoom lens and the signal input module.

Abstract: An LED lighting assembly integrated with dielectric liquid lens, including: a heat dissipation substrate; an LED chip, located on the heat dissipation substrate; a transparent material, covering the heat dissipation substrate and the LED chip and having a curved surface; a transparent liquid, located above the transparent material; a transparent layer, located above the transparent liquid; a first dielectric liquid, located above the transparent layer; a second dielectric liquid, located above the first dielectric liquid and having a curved surface, wherein the second dielectric liquid has a second dielectric constant smaller than a first dielectric constant of the first dielectric liquid; a transparent electrode layer, located above the second dielectric liquid for applying a control voltage to generate a dielectric force on the second dielectric liquid; and an enclosing body.

Abstract: A light bulb includes a base unit, an electrical connecting unit, a light-emitting unit, and a lamp cover unit. The base unit includes a base body connected with the electrical connecting unit. The light-emitting unit includes a substrate body disposed on the base body, a plurality of blue and red light emitting groups disposed on the substrate body and electrically connected with the substrate body, and a phosphor resin body formed on the substrate body to cover the blue and red light emitting groups. Each blue light emitting group includes a plurality of blue light emitting elements electrically connected with each other in series, and each red light emitting group includes a plurality of red light emitting elements electrically connected with each other in series. The lamp cover unit includes a light-permitting cover disposed on the top side of the base body to cover the light-emitting unit.

Abstract: A light bulb includes a base unit, an electrical connecting unit, a light-emitting unit, and a lamp cover unit. The base unit includes a base body connected with the electrical connecting unit. The light-emitting unit includes a substrate body disposed on the base body, a plurality of blue and red light emitting groups disposed on the substrate body and electrically connected with the substrate body, and a phosphor resin body formed on the substrate body to cover the blue and red light emitting groups. Each blue light emitting group includes a plurality of blue light emitting elements electrically connected with each other in series, and each red light emitting group includes a plurality of red light emitting elements electrically connected with each other in series. The lamp cover unit includes a light-permitting cover disposed on the top side of the base body to cover the light-emitting unit.

Abstract: A LED package structure capable of adjusting the spatial color uniformity and the light distribution curve includes a substrate unit, a light-emitting unit, a transparent package unit, and a phosphor package unit. The light-emitting unit includes at least one light-emitting element for generating a light-emitting source to show a predetermined light distribution curve. The transparent package unit includes a transparent package resin body covering the light-emitting element. The phosphor package unit includes a phosphor package resin body covering the transparent package resin body. Hence, when the light-emitting source generated by the light-emitting element is transformed into a light-projecting source through the transparent package resin body and the phosphor package resin body sequentially, and the spatial color uniformity and the light distribution curve of the light-projecting source can be adjusted according to the phosphor package resin body having a non-uniform thickness.

Abstract: A lamp structure includes an electrical connection unit, a light emitting unit, and a light guiding unit. The electrical connection unit includes an electrical connection element. The light emitting unit includes at least one light emitting element disposed on the top side of the electrical connection unit and electrically connected to the electrical connection element. The light guiding unit includes a light guiding element disposed on the top side of the electrical connection unit. The light guiding element has a bottom light-input surface, a top light-output surface, and a surrounding light-output surface. The surrounding light-output surface has a first surrounding region gradually outwardly expanded from bottom to top, a second surrounding region connected to the first surrounding region and gradually inwardly contracted from bottom to top, and a third surrounding region connected to the second surrounding region and gradually outwardly expanded from bottom to top.

Abstract: A LED package structure includes a substrate unit, a light emitting unit, a package unit, and a phosphor unit. The substrate unit includes a substrate body. The light emitting unit includes at least one light emitting element disposed on and electrically connected to the substrate body. The package unit includes a package resin body formed on the substrate body to cover the light emitting element. The package resin body has a light output surface formed on the top surface thereof to guide light beams generated by the light emitting element to leave the package resin body. The phosphor unit includes a prefabricated phosphor cap disposed on the substrate body to enclose the package resin body. The prefabricated phosphor cap is separated from the package resin body by a predetermined distance to form a receiving portion between the prefabricated phosphor cap and the package resin body.

Abstract: A LED package structure for increasing the light uniforming effect includes a substrate unit, a light emitting unit, a first package unit, and a second package unit. The substrate unit includes at least one substrate body. The light emitting unit includes at least one light emitting element disposed on the at least one substrate body and electrically connected to the at least one substrate body. The first package unit includes a first package resin body formed on the at least one substrate body to cover the at least one light emitting element. The second package unit includes a second package resin body formed on the at least one substrate body to cover the first package resin body. The second package resin body is a light uniforming resin body having a light diffusing material mixed therein, and the second package resin body has an exposed light uniforming surface formed thereon.

Abstract: A multi-chip light emitting diode (LED) package having a plurality of LED chips, a substrate, and a plurality of conductive paste layers is provided. The substrate has at least two hollow areas with conductive patterns formed on a bottom surface thereon. The conductive paste layers are pasted on the bottom surfaces of the hollow areas respectively for fixing the LED chips and having the LED chips electrically connected to the conductive patterns. The LED chips in the different hollow areas are electrically connected in serial.

Abstract: An LED lamp is provided. The LED lamp has an aluminum board, a buffer substrate, at least a LED chip, a metal layer structure, and heat sink. The aluminum board has a cup structure thereon. The buffer substrate is assembled on a bottom surface of the cup structure. The LED chips are assembled on the buffer substrate. The metal layer structure is formed on a bottom surface of the aluminum board. The metal layer structure is composed of solderable materials. The heat sink is connected to the metal layer structure through solder joint.

Abstract: A light emitting diode (LED) package unit, including a substrate having a concave, a LED chip, at least two electrodes, at least two wires, a gel and a first wavelength-converting material. The LED chip, disposed in the concave, including a top-face, a bottom-face for jointing with the substrate, and at least two chip-electrodes. The LED chip emits light of a first wavelength. The electrodes are disposed on the substrate. The wires are respectively connecting one of the chip-electrode with one of the electrode. The gel is disposed to seal the LED chip and the wires. The first wavelength-converting material including Sr—Si—O—N:Eu is doped within the gel. The first wavelength-converting material absorbs light of the first wavelength and emits light of a second wavelength longer than the first wavelength.

Abstract: An LED package structure includes a lower substrate, an upper substrate disposed on the lower substrate and having a though hole exposing a portion of the upper surface of the lower substrate; an individual LED unit disposed within the through hole in the upper substrate, a conductive pattern layer disposed on the upper substrate, a conducting wire interconnecting electrically the LED unit and the conductive pattern layer, and an encapsulating body disposed on the conductive pattern layer in such a manner that the encapsulating body hermetically encloses the LED unit, the through hole in the upper substrate and an inner peripheral portion of the conductive pattern layer surrounding the through hole. The lower and upper substrates are separately formed.