Abstract: A lighting device capable of changing light patterns, includes: (a) a heat dissipating substrate; (b) a light source, located on the heat dissipating substrate; (c) a first dielectric liquid, covering the light source and having a first dielectric constant; (d) a second dielectric liquid, covering the first dielectric liquid and having a second dielectric constant; and (e) an enclosing wall, located on the heat dissipating substrate for containing the first dielectric liquid and the second dielectric liquid.

Abstract: A LED package structure includes a substrate unit, a light-emitting unit, a support unit, a lens unit, an input unit and a control unit. The light-emitting unit includes at least one light-emitting element electrically connected to the substrate unit. The support unit includes a support element disposed on the substrate unit and surrounding the light-emitting element. The lens unit includes an electrically-controlled zoom lens disposed above the light-emitting element and retained by the support element. The input unit includes a signal input module for providing a predetermined voltage signal. The control unit includes a voltage controlling module electrically connected between the electrically-controlled zoom lens and the signal input module.

Abstract: An LED lighting assembly integrated with dielectric liquid lens, including: a heat dissipation substrate; an LED chip, located on the heat dissipation substrate; a transparent material, covering the heat dissipation substrate and the LED chip and having a curved surface; a transparent liquid, located above the transparent material; a transparent layer, located above the transparent liquid; a first dielectric liquid, located above the transparent layer; a second dielectric liquid, located above the first dielectric liquid and having a curved surface, wherein the second dielectric liquid has a second dielectric constant smaller than a first dielectric constant of the first dielectric liquid; a transparent electrode layer, located above the second dielectric liquid for applying a control voltage to generate a dielectric force on the second dielectric liquid; and an enclosing body.

Abstract: A light bulb includes a base unit, an electrical connecting unit, a light-emitting unit, and a lamp cover unit. The base unit includes a base body connected with the electrical connecting unit. The light-emitting unit includes a substrate body disposed on the base body, a plurality of blue and red light emitting groups disposed on the substrate body and electrically connected with the substrate body, and a phosphor resin body formed on the substrate body to cover the blue and red light emitting groups. Each blue light emitting group includes a plurality of blue light emitting elements electrically connected with each other in series, and each red light emitting group includes a plurality of red light emitting elements electrically connected with each other in series. The lamp cover unit includes a light-permitting cover disposed on the top side of the base body to cover the light-emitting unit.

Abstract: A multi-chip light emitting diode (LED) package having a plurality of LED chips, a substrate, and a plurality of conductive paste layers is provided. The substrate has at least two hollow areas with conductive patterns formed on a bottom surface thereon. The conductive paste layers are pasted on the bottom surfaces of the hollow areas respectively for fixing the LED chips and having the LED chips electrically connected to the conductive patterns. The LED chips in the different hollow areas are electrically connected in serial.

Abstract: An LED lamp is provided. The LED lamp has an aluminum board, a buffer substrate, at least a LED chip, a metal layer structure, and heat sink. The aluminum board has a cup structure thereon. The buffer substrate is assembled on a bottom surface of the cup structure. The LED chips are assembled on the buffer substrate. The metal layer structure is formed on a bottom surface of the aluminum board. The metal layer structure is composed of solderable materials. The heat sink is connected to the metal layer structure through solder joint.

Abstract: A light emitting diode (LED) package unit, including a substrate having a concave, a LED chip, at least two electrodes, at least two wires, a gel and a first wavelength-converting material. The LED chip, disposed in the concave, including a top-face, a bottom-face for jointing with the substrate, and at least two chip-electrodes. The LED chip emits light of a first wavelength. The electrodes are disposed on the substrate. The wires are respectively connecting one of the chip-electrode with one of the electrode. The gel is disposed to seal the LED chip and the wires. The first wavelength-converting material including Sr—Si—O—N:Eu is doped within the gel. The first wavelength-converting material absorbs light of the first wavelength and emits light of a second wavelength longer than the first wavelength.

Abstract: An LED package structure includes a lower substrate, an upper substrate disposed on the lower substrate and having a though hole exposing a portion of the upper surface of the lower substrate; an individual LED unit disposed within the through hole in the upper substrate, a conductive pattern layer disposed on the upper substrate, a conducting wire interconnecting electrically the LED unit and the conductive pattern layer, and an encapsulating body disposed on the conductive pattern layer in such a manner that the encapsulating body hermetically encloses the LED unit, the through hole in the upper substrate and an inner peripheral portion of the conductive pattern layer surrounding the through hole. The lower and upper substrates are separately formed.

Abstract: An LED assembly includes a first LED unit and a second LED unit, the latter is coupled electrically to the first LED unit in such a manner that each of the first and second LED units defines a current-flow direction in reverse order so that once Alternating Current is applied, the first and second LED units are illuminated alternately by virtue of the positive and negative voltages of the Alternating Current.

Abstract: A light emitting diode (LED) packaging comprising a stacked substrate, a main body, and an LED die is provided. The stacked substrate includes a heat spreader and a first circuit board. The first circuit board is stacked on the heat spreader. Two channels penetrate the first circuit board and the heat spreader. An upper opening of the channel is smaller than a lower opening thereof. The main body is formed on the first circuit board and has a through hole to expose part of the first circuit board. The main body further has at least two extended portion filling the channels for fixing the main body on the stacked substrate. The LED die is located in the through hole and electrically connected to the first circuit board.