Abstract: The invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as to a test probe equipped with such a test needle and to a flying probe tester for testing printed circuit boards equipped with such a test needle or such a test probe. The test needle has a capacitive measuring body, which is connected via a cable to a capacitive measuring device. The cable is shielded so that only the capacitive measuring body can form a capacitive coupling with other electrically conductive bodies. This makes it possible to determine this capacitive coupling with a high local resolution.

Abstract: A module for a tester for the testing of circuit boards is described. Such testers have a basic grid on which an adapter and/or a translator may be arranged in order to connect contact points of the basic grid with circuit board test points of a circuit board to be tested. The module comprises a support plate and a contact board. The contact board is formed by a rigid circuit board section which is described as the basic grid element, and at least one flexible circuit board section. Provided on the basic grid element are contact points which each form part of the contact points of the basic grid. The basic grid element is mounted at an end face of the support plate, and the flexible circuit board section is bent in such a way that at least part of the other section of the contact board is parallel to the support plate.

Abstract: A finger tester for testing non-componented printed circuit boards uses two or more test fingers, each having a test probe. A detection device is provided above each test probe for optical detection of the position above the circuit board of at least one contact tip of the test probe. The detection devices of the test fingers are each arranged in different vertically spaced planes, so that areas of the detection devices located above the test fingers are positioned above one another, aligned vertically to prevent contact during testing.

Abstract: The invention relates to a method and a device for the testing of noncomponented circuit boards. The method according to the invention is used to determine deviations of circuit board test points of a series of circuit boards from the CAD data relating to these circuit boards, by scanning the surface of the circuit board by an imaging method and subjecting this image to automatic image analysis so that it may be compared with the CAD data. The CAD data are then suitably corrected so that, with the aid of the corrected CAD data, the circuit board may be tested in a finger tester, with test fingers of the finger tester being controlled on the basis of the deviations found.

Abstract: A module for a tester for the testing of circuit boards is described. Such testers have a basic grid on which an adapter and/or a translator may be arranged in order to connect contact points of the basic grid with circuit board test points of a circuit board to be tested. The module comprises a support plate and a contact board. The contact board is formed by a rigid circuit board section which is described as the basic grid element, and at least one flexible circuit board section. Provided on the basic grid element are contact points which each form part of the contact points of the basic grid. The basic grid element is mounted at an end face of the support plate, and the flexible circuit board section is bent in such a way that at least part of the other section of the contact board is parallel to the support plate.

Abstract: The method according to the invention is used to determine deviations of circuit board test points of a series of circuit boards from the CAD data relating to these circuit boards, by scanning the surface of the circuit board by an imaging method and subjecting this image to automatic image analysis so that it may be compared with the CAD data. The CAD data are then suitably corrected so that, with the aid of the corrected CAD data, the circuit board may be tested in a finger tester, with test fingers of the finger tester being controlled on the basis of the deviations found.

Abstract: The present invention relates to a finger tester for the testing of non-componented printed circuit boards using at least two test fingers (1), each of which has a test probe (2), and wherein there is provided above each test probe (2) a detection device (20) for optical detection of the position of at least one contact tip of the test probe (2). The detection devices (20) of the two or more test fingers (1) are arranged in different vertically spaced planes, so that at least areas of the detection devices (20) located above the test finger (1) may be positioned above one another, aligned vertically without contact.

Abstract: Printed circuit boards are tested in accordance with a method in which the circuit boards (1) are brought into contact with conducting test-contact elements (5) at certain contact points (3) which are connected to the conductor tracks (2), the test-contact elements (5) or a partial number thereof are connected, in succession in clock-pulsed manner according to a certain test program, to a test-voltage source (8) and during each test clock pulse the flowing via the test-contact elements (5) or a parameter related thereto is measured. Particularly for circuit boards (1) to be tested having a high contact-point density, the testing-time can be shortened by the circuit boards being subdivided into a plurality of test areas and all or at least some of the test areas being tested in parallel. The method is especially suitable for circuit boards that are produced in a multiple panel.

Abstract: A method and a device for loading an adapter for a printed circuit board testing device with adapter pins having head ends and contact ends. The adapter pins to be loaded into the adapter are transferred by gravity from at least one main magazine, with their head ends first, into an intermediate magazine. Also, the adapter pins that have been transferred into the intermediate magazine are then transferred by gravity with the contact ends first into the adapter. For simpler and more rapid loading of the adapter with minimal constructional outlay, the adapter pins are transferred from the main magazine head first into the intermediate magazine.

Abstract: A self-programming printed circuit board tester which receives and stores information corresponding to the conductive and insulative relationships between test points or master printed circuit boards and then compares that information to information received from boards to be tested and an adapter for connecting each master printed circuit board to the tester, the adapter having a memory which stores and supplies to the tester information corresponding to information supplied through the adapter to the tester from a perfect master printed circuit board.

Abstract: Conductor plates are fed to a conductor plate tester from a stack by a reciprocating feeder which removes the lowermost plate only of the stack and propels it forwardly to a transport path. The transport path is inclined downwardly toward said tester, the feeder is also inclined at the same angle, with the stack perpendicular thereto. As a result, the conductor plates are moved along the transport path by the force of gravity.

Abstract: Sorting and stacking tested conductor plates by forming from the bottom up a stack of conductor plates which have passed the tests, raising from the bottom the entire stack each time a tested conductor plate approaches the bottom of the stack, feeding each tested conductor plate beneath the raised stack to temporary support means, actuating the temporary support means to eject a failed said plate, lowering the stack after an ejection opportunity has passed, whether used or not, and lowering the lifting means below the latest tested plate that has passed the test, so that such a plate is incorporated into the stack before the lifting means is next activated.

Abstract: A conductor plate and a method for determining the offset between conductor paths and contact holes in the conductor plate. Conductor paths with contact eyes and at least one control mark are simultaneously applied, and, in a later step, contact holes and a control hole for each control mark are simultaneously punched through the conductor plate. Then the position of the control hole is determined relative to its associated control mark. The control mark has at least one curved control path which encloses, on at least one side, a control area of the conductor plate; the control hole is centrally located within the control area when the contact holes are centrally located within their associated contact eyes. Preferably, there are two control marks disposed diagonally opposite each other and pointing in different directions. Each control mark may comprise a group of control paths disposed within one another.

Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.