Abstract: Techniques regarding a reclosure label are provided. For example, one or more embodiments described herein can comprise a reclosure label that includes a flap portion connected to a label base. Further, the flap portion can comprise a rigid material layer. Additionally, the reclosure label can comprise a flexible material layer that is integral with the flap portion and the label base and forms a hinge portion that enables the flap portion to pivot with respect to the label base. Moreover, the rigid material layer can be absent from the hinge portion.

Abstract: A die cutting method that cuts patterns in a label is provided. According an embodiment, a method adjusts temperature of a label sheet comprising a laminated layer and a liner layer. The method further separates the laminated layer from the liner layer prior to making the cuts on the laminated layer. The method further cuts one or more patterns on the laminated layer. The method further re-attaches, the laminated layer to the liner layer.