Abstract: Disclosed is an immersed cabinet, which includes a cabinet body and a heat sink assembly, wherein the heat sink assembly is in sealed connection with the cabinet body and configured to seal an opening of the cabinet body. The cabinet body accommodates a plurality of devices to be cooled, and cooling liquid is put in the cabinet body and used for immersing the plurality of devices to be cooled. The cooling liquid absorbs heat generated by the plurality of devices to be cooled and then is vaporized. The heat sink assembly exchanges heat with the vaporized cooling liquid, so that the vaporized cooling liquid condenses and flows back to the cabinet body for circulation, and the heat sink assembly dissipates the heat into the atmosphere. Therefore, the heat dissipation structure design of the immersed cabinet is effectively simplified.