Abstract: Systems and methods for setting, assembling, and/or monitoring deflection (and thus load) in a load beam of a clamping system for a press pack high power semiconductor. The clamping system includes an assembly of a heat sink, a clamp component, and a semiconductor package. The clamp component includes two or more bolts securely connecting a load beam to the heat sink, with the semiconductor package sandwiched between the load beam and the heat sink. A detector and a calibration gage can be assembled onto the clamping system to detect and/or measure the depth of curvature of the load beam.