Patents Assigned to LX Semicon Co., Ltd.
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Patent number: 12293696Abstract: Disclosed is a method of controlling a display device, the method including generating a plurality of Average Picture Level (APL) data for each specific period within a vertical blank period by a first display module, transmitting a plurality of the APL data to a second display module at a specific timing point by the first display module, receiving a plurality of the APL data by the second display module, and processing image data by the second display module based on a specific APL data among a plurality of the received APL data.Type: GrantFiled: January 29, 2024Date of Patent: May 6, 2025Assignee: LX SEMICON CO., LTD.Inventors: You Jin Kwon, A Reum Kim, Jae Eun Lee
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Patent number: 12294723Abstract: The present invention relates to a method for encoding/decoding a video. To this end, the method for decoding a video may include: deriving a spatial merge candidate from at least one of spatial candidate blocks of a current block, deriving a temporal merge candidate from a co-located block of the current block, and generating a prediction block of the current block based on at least one of the derived spatial merge candidate and the derived temporal merge candidate, wherein a reference picture for the temporal merge candidate is selected based on a reference picture list of a current picture including the current block and a reference picture list of a co-located picture including the co-located block.Type: GrantFiled: March 22, 2024Date of Patent: May 6, 2025Assignee: LX SEMICON CO., LTD.Inventors: Dong San Jun, Ha Hyun Lee, Jung Won Kang, Hyun Suk Ko, Sung Chang Lim, Jin Ho Lee, Seung Hyun Cho, Hui Yong Kim, Jin Soo Choi
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Patent number: 12294721Abstract: An image encoding/decoding method may comprise deriving at least one merge candidate of a current block, generating an initial merge candidate list of the current block by using the derived at least one merge candidate and generating a reconfigured merge candidate list by using the initial merge candidate list.Type: GrantFiled: August 9, 2023Date of Patent: May 6, 2025Assignee: LX SEMICON CO., LTD.Inventors: Dong San Jun, Jung Won Kang, Hyun Suk Ko, Sung Chang Lim, Jin Ho Lee, Ha Hyun Lee, Hui Yong Kim
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Patent number: 12289454Abstract: An image encoding/decoding method and apparatus for performing intra prediction mode based intra prediction are provided. An image decoding method may comprise decoding an intra prediction mode of a current block, deriving at least one intra prediction mode from the decoded intra prediction mode of the current block, generating two or more intra prediction blocks using the intra prediction mode of the current block and the derived intra prediction mode, and generating an intra prediction block of the current block based on the two or more intra prediction blocks.Type: GrantFiled: July 26, 2023Date of Patent: April 29, 2025Assignee: LX Semicon Co., Ltd.Inventors: Sung Chang Lim, Hyun Suk Ko, Jung Won Kang, Jin Ho Lee, Ha Hyun Lee, Dong San Jun, Hui Yong Kim
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Publication number: 20250133817Abstract: A semiconductor device includes a first device configured to receive a first level voltage through a first terminal, and output a first output voltage through a second terminal when a gate voltage is applied through a gate terminal; a boost device configured to receive a second level voltage through a first terminal, and output a second output voltage having a higher value than the first output voltage when the first output voltage is applied as a gate voltage through a gate terminal; and a second device configured to receive a third level voltage through a first terminal, and output a third output voltage when the second output voltage is applied as a gate voltage through a gate terminal, wherein the second output voltage is greater than a threshold voltage of the second device.Type: ApplicationFiled: December 27, 2022Publication date: April 24, 2025Applicant: LX SEMICON CO., LTD.Inventor: Kee Joon CHOI
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Publication number: 20250133768Abstract: A power semiconductor device, a power semiconductor module including the same, a power converter, and methods of manufacture are provided. The power semiconductor device can include a substrate, a first conductivity type epitaxial layer disposed on the substrate, and a stepped well structure, where the width of a lower region of the stepped well structure is narrower than an upper region, but wider than an insulating or trench region.Type: ApplicationFiled: August 14, 2024Publication date: April 24, 2025Applicant: LX SEMICON CO., LTD.Inventors: Jin Ok PARK, Nam Ju KANG, Seung Wook SONG, Doo Hyung LEE, Chae Deok LEE
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Patent number: 12282623Abstract: The present disclosure relates to a microcontroller, a readout integrated circuit and a method of driving a circuit, and more particularly, to a microcontroller, a readout integrated circuit and a method of driving a circuit to transmit command signals by using a pair of lines, through which signals are transmitted from the microcontroller which is a master circuit to the readout integrated circuit which is a slave circuit, as two single-ended signal transmission lines and to control power of the readout integrated circuit which is a slave circuit.Type: GrantFiled: April 20, 2022Date of Patent: April 22, 2025Assignee: LX SEMICON CO., LTD.Inventors: Ji Ho Kim, Jun Tak Jeon, Kyung Hwan Kim, Sung Chun Kim
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Publication number: 20250126272Abstract: An image decoding method performed by a decoding apparatus, an image encoding method performed by an encoding apparatus, and a transmission method for image data are discussed. The image decoding method can include obtaining image information comprising information related to motion compensation from a bitstream, deriving merge candidates of a current block, generating a merge candidate list of the current block based on the derived merge candidates, determining motion information of the current block based on the merge candidate list, and generating a predicted block of the current block based on the motion information of the current block. The information related to the motion compensation includes motion vector resolution information. The motion vector resolution information indicates a specific motion vector resolution among motion vector resolution candidates including an integer pel resolution, a ¼ pel resolution and a 1/16 pel resolution.Type: ApplicationFiled: December 20, 2024Publication date: April 17, 2025Applicant: LX Semicon Co., Ltd.Inventors: Dong San JUN, Ha Hyun LEE, Jung Won KANG, Hyun Suk KO, Sung Chang LIM, Jin Ho LEE, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI
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Publication number: 20250126273Abstract: An image decoding method performed by a decoding apparatus, an image encoding method performed by an encoding apparatus, and a transmission method for image data are discussed. The image decoding method can include obtaining image information comprising information related to motion compensation from a bitstream, deriving merge candidates of a current block, generating a merge candidate list of the current block based on the derived merge candidates, determining motion information of the current block based on the merge candidate list, and generating a predicted block of the current block based on the motion information of the current block. The information related to the motion compensation includes motion vector resolution information. The motion vector resolution information indicates a specific motion vector resolution among motion vector resolution candidates including an integer pel resolution, a ¼ pel resolution and a 1/16 pel resolution.Type: ApplicationFiled: December 20, 2024Publication date: April 17, 2025Applicant: LX Semicon Co., Ltd.Inventors: Dong San JUN, Ha Hyun LEE, Jung Won KANG, Hyun Suk KO, Sung Chang LIM, Jin Ho LEE, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI
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Publication number: 20250126275Abstract: An image decoding method performed by a decoding apparatus, an image encoding method performed by an encoding apparatus, and a transmission method for image data are discussed. The image decoding method can include obtaining image information comprising information related to motion compensation from a bitstream, deriving merge candidates of a current block, generating a merge candidate list of the current block based on the derived merge candidates, determining motion information of the current block based on the merge candidate list, and generating a predicted block of the current block based on the motion information of the current block. The information related to the motion compensation includes motion vector resolution information.Type: ApplicationFiled: December 20, 2024Publication date: April 17, 2025Applicant: LX Semicon Co., Ltd.Inventors: Dong San JUN, Ha Hyun LEE, Jung Won KANG, Hyun Suk KO, Sung Chang LIM, Jin Ho LEE, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI
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Publication number: 20250126251Abstract: An image decoding method performed by a decoding apparatus, an image encoding method performed by an image encoding apparatus, and a transmission method for image data are discussed. The image decoding method can include obtaining a coding block by partitioning an image, determining a size of the coding block, determining a split type for the coding block based on the size of the coding block, deriving a current block split from the coding block based on the split type for the coding block, and reconstructing the current block. Based on that the size of the coding block is equal to or greater than a first size, the split type for the coding block is implicitly determined as that the coding block is split into four equal-sized subblocks.Type: ApplicationFiled: December 20, 2024Publication date: April 17, 2025Applicant: LX Semicon Co., Ltd.Inventors: Hyun Suk KO, Jin Ho LEE, Sung Chang LIM, Jung Won KANG, Ha Hyun LEE, Dong San JUN, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI
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Publication number: 20250126274Abstract: An image decoding method performed by a decoding apparatus, an image encoding method performed by an encoding apparatus, and a transmission method for image data are discussed. The image decoding method can include obtaining image information comprising information related to motion compensation from a bitstream, deriving merge candidates of a current block, generating a merge candidate list of the current block based on the derived merge candidates, determining motion information of the current block based on the merge candidate list, and generating a predicted block of the current block based on the motion information of the current block. The information related to the motion compensation includes motion vector resolution information, and the motion vector resolution information indicates a specific motion vector resolution among motion vector resolution candidates including an integer pel resolution, a ¼ pel resolution and a 1/16 pel resolution.Type: ApplicationFiled: December 20, 2024Publication date: April 17, 2025Applicant: LX Semicon Co., Ltd.Inventors: Dong San JUN, Ha Hyun LEE, Jung Won KANG, Hyun Suk KO, Sung Chang LIM, Jin Ho LEE, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI
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Patent number: 12278956Abstract: An image encoding/decoding method and apparatus for performing intra prediction using a plurality of reference sample lines are provided. An image decoding method may comprise configuring a plurality of reference sample lines, reconstructing an intra prediction mode of a current block, and performing intra prediction for the current block based on the intra prediction mode and the plurality of reference sample lines.Type: GrantFiled: May 28, 2024Date of Patent: April 15, 2025Assignee: LX SEMICON CO., LTD.Inventors: Jin Ho Lee, Jung Won Kang, Hyun Suk Ko, Sung Chang Lim, Ha Hyun Lee, Dong San Jun, Hui Yong Kim
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Publication number: 20250118242Abstract: A source drive integrated circuit (IC) includes: one or more digital circuit parts configured to receive a digital signal; a plurality of signal wires connected to the digital circuit parts and configured to transmit the digital signal to the digital circuit parts; and a clock wire connected to the digital circuit parts and configured to transmit a clock to the digital circuit parts. Each of the signal wires and the clock wire includes: an input wire located at the center in the length direction of the digital circuit parts; and branch wires branching off to both sides of the input wire along the length direction of the digital circuit parts.Type: ApplicationFiled: October 9, 2024Publication date: April 10, 2025Applicant: LX SEMICON CO., LTD.Inventor: Jin Young YU
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Publication number: 20250118680Abstract: A power converter including a power semiconductor module and a power semiconductor module, and a method of manufacturing the same comprising an insulating substrate for a heat dissipation substrate, a heat dissipation substrate for a power semiconductor module, a power semiconductor module including a heat dissipation substrate. A heat dissipation substrate for a power semiconductor module may include a first metal plate, an insulating substrate bonded to the first metal plate, and a second metal plate bonded to the insulating substrate. A first thickness of the first metal plate may be different from the second thickness of the second metal plate. The first thickness of the first metal plate may be thinner than the second thickness of the second metal plate. The first metal plate may comprise a circuit pattern electrically connected to a power semiconductor device, and the second metal plate may include a marked unique code.Type: ApplicationFiled: May 31, 2024Publication date: April 10, 2025Applicant: LX SEMICON CO., LTD.Inventor: Min Yup JANG
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Publication number: 20250118624Abstract: The embodiment relates to a power converter including a power semiconductor module and a power semiconductor module, and a method of manufacturing the same comprising an insulating substrate for a heat dissipation substrate, a heat dissipation substrate for a power semiconductor module, a power semiconductor module including a heat dissipation substrate. The method of manufacturing a heat dissipation substrate for a power semiconductor module may include preparing an insulating substrate, preparing first and second metal plates, stacking the first metal plate, stacking the insulating substrate on the first metal plate, stacking the second metal plate on the insulating substrate and performing a hot-pressing process on the stacked first metal plate, the insulating substrate, and the second metal plate. A first thickness of the first metal plate may be different from a second thickness of the second metal plate.Type: ApplicationFiled: May 30, 2024Publication date: April 10, 2025Applicant: LX SEMICON CO., LTD.Inventor: Min Yup JANG
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Publication number: 20250118636Abstract: A power converter including a power semiconductor module and a power semiconductor module, and a method of manufacturing the same comprising an insulating substrate for a heat dissipation substrate, a heat dissipation substrate for a power semiconductor module, a power semiconductor module including a heat dissipation substrate. A heat dissipation substrate for a power semiconductor module may include a first metal plate, an insulating substrate bonded to the first metal plate, and a second metal plate bonded to the insulating substrate. A first thickness of the first metal plate may be different from the second thickness of the second metal plate. The first thickness of the first metal plate may be thinner than the second thickness of the second metal plate. The first metal plate may comprise a circuit pattern electrically connected to a power semiconductor device, and the second metal plate may include a marked unique code.Type: ApplicationFiled: May 30, 2024Publication date: April 10, 2025Applicant: LX SEMICON CO., LTD.Inventor: Min Yup JANG
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Publication number: 20250118573Abstract: The embodiment relates to a ceramic substrate for a heat dissipation substrate, a heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same, a power converter including the same, and a method of manufacturing the same. The method of manufacturing a heat dissipation substrate for a power semiconductor module includes preparing an insulating substrate, preparing first and second metal plates, stacking the first metal plates, stacking the insulating substrate on the first metal plate, stacking a second metal plate on the insulating substrate and performing a hot press process on the stacked first metal plate, the insulating substrate, and the second metal plate. And A first thickness of the first metal plate may be different from a second thickness of the second metal plate.Type: ApplicationFiled: May 31, 2024Publication date: April 10, 2025Applicant: LX SEMICON CO., LTD.Inventor: Min Yup JANG
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Patent number: 12273034Abstract: The present disclosure provides for sequentially turning on a plurality of power conversion modules according to the magnitude of load power at the time of driving the power conversion modules, operating power conversion modules which have already been turned on in an optimum efficiency interval, and providing increased load power through a power conversion module which has been newly turned on.Type: GrantFiled: December 28, 2022Date of Patent: April 8, 2025Assignee: LX SEMICON CO., LTD.Inventors: Won Suk Jang, Tae Kyu Nam, Young Kook Ahn, Sang Woo Kim, Jung Woong Park, Tae Heon Lee, In Ho Jeon
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Patent number: 12272331Abstract: The present disclosure relates to a display apparatus and control method thereof. The display apparatus includes a receiver configured to receive input image data, an accumulator configured to generate a cumulative data count by analyzing a degree of degradation according to the received input image data and a burn-in factor, an interpolator configured to update the cumulative data count in a memory by applying an adaptive weight to the generated cumulative data count, and a compensator configured to generate compensation data using the input image data and the updated cumulative data count.Type: GrantFiled: December 12, 2023Date of Patent: April 8, 2025Assignee: LX SEMICON CO., LTD.Inventors: Jae Chan Cho, Jun Young Park, Seul Gi Lee, Ji Won Lee