Abstract: A wafer transfer arm made from a machineable material for picking up and delivering a semiconductor wafer from one location to another, includes a blade body with a longitudinal channel extending along one surface, and a coverplate adapted to matingly fit into the channel for defining a vacuum conduit therein. The vacuum conduit provides fluid communication between an inlet at one end of the blade body and an outlet at the other end, for suctionally retaining the semiconductor wafer by vacuum pressure or suction.
Type:
Grant
Filed:
December 2, 1999
Date of Patent:
June 12, 2001
Assignee:
M.E.C. Technology, Inc.
Inventors:
Matthew Peter Szapucki, Richard Kulkaski, Trevor J. Hadley, Mark Anthony Santorelli
Abstract: A plasma reactor showerhead electrode assembly for processing semiconductor wafers comprised of a typically silicon disk shaped gas plate having a plurality of gas passage holes formed therethrough by a ultrahigh velocity water jet boring apparatus, and a graphite circular split collar assembly including first and second semicircular sections forming a circumferential inner slot when opposing ends of said sections are secured together, the slot mating in a dovetail connection with an outer circumferential groove of said gas plate for retaining the latter between said sections. A conductive gasket may be interposed between the gas plate groove and the mating collar assembly to provide an electrically and thermally conductive seal. The first and second semicircular sections have opposing ends screwed or pinned together for providing easy disassembly thereof for replacement of the gas plate.
Type:
Grant
Filed:
January 24, 2000
Date of Patent:
May 29, 2001
Assignee:
M.E.C. Technology, Inc.
Inventors:
Matthew P. Szapucki, Richard Kulkaski, Trevor J. Hadley, Mark Anthony Santorelli
Abstract: A showerhead electrode assembly for a plasma reactor for processing semiconductor wafers includes a gas plate having a plurality of through holes for passage of gas. The top face or side of the gas plate is of smaller diameter than the bottom side or face of the gas plate. An acutely angled peripheral groove is formed between the top face of the gas plate, and the lower portion thereof, with the groove terminating at a band-like ledge with the top face and lower portion. A locking ring is provided by two identical semicircular sections, each of which include in a lower portion of an inside sidewall, respectively, an acutely angled peripheral groove for mating with the groove of the gas plate. A unitary circular support collar is formed with a circular channel in a bottom portion thereof.
Type:
Grant
Filed:
January 24, 2000
Date of Patent:
January 9, 2001
Assignee:
M.E.C. Technology, Inc.
Inventors:
Matthew Peter Szapucki, Richard Kulkaski, Trevor J. Hadley, Mark Anthony Santorelli
Abstract: A plasma reactor showerhead electrode assembly for processing semiconductor wafers comprised of a typically silicon disk shaped gas plate having a plurality of gas passage holes therethrough, and a graphite circular split collar assembly including first and second semicircular sections forming a circumferential inner slot when opposing ends of said sections are secured together, the slot mating in a dovetail connection with an outer circumferential groove of said gas plate for retaining the latter between said sections. A conductive gasket may be interposed between the gas plate groove and the mating collar assembly to provide an electrically and thermally conductive seal. The first and second semicircular sections have opposing ends screwed or pinned together for providing easy disassembly thereof for replacement of the gas plate.
Type:
Grant
Filed:
August 21, 1998
Date of Patent:
April 18, 2000
Assignee:
M.E.C. Technology, Inc.
Inventors:
Matthew Peter Szapucki, Richard Kulkaski, Trevor J. Hadley, Mark Anthony Santorelli, Robert H. Stoever